Difference between revisions of "Assembly levels"

From apm
Jump to: navigation, search
m (→‎Notes:)
m (→‎Related)
 
(104 intermediate revisions by the same user not shown)
Line 1: Line 1:
 +
[[File:NanosystemsNotAProposedDesignConvergentAssembly.jpg|350px|thumb|right|'''THIS IS NOT A PROPOSED DESIGN (so explicitly stated in [[Nanosystems]])'''. Just an example of a non-planar [[convergent assembly]] topology and geometry (or morphology as in biology). '''More or less planar [[assembly layers]] likely match natural scaling laws much better.''' {{wikitodo|Add Josh Halls analytic math comparison to scaling laws in bio-systems too. Plus his picture.}}]]
  
−
The '''assembly levels''' describe how an advanced productive nanosystem of [[technology level III]] will be organized. They constitute a greatly implementation agnostic scheme for the organisation of an advanced productive nanosystem on the bottommost levels.  
+
There are two options how things can be assembled.
  
−
Since waste is a serious [[dangers|danger]] of this [[waste|potentially clean]] technology a special focus on [[recycling]] is taken here.
+
* in place right from its most fundamental constituents to its final complete form
 +
* out of place from smaller subcomponents to bigger subcomponents in a series of successively bigger assembly stations.
  
−
Note that the used abbreviations in italic are newly proposed terms.
+
The assembly stations plus everything additionally necessary on the same size scale for integrating them into an integrated system like a [[gem-gum factory]] are here defined to be called "assembly levels".
  
−
=Level 0: (''preparating tooltips'')=
+
Note: Assembly levels do not talk about specific system geometries like e.g. [[assembly lavers]] talk about a layered configuration.
  
−
Here the tooltips are loaded with feedstock molecules (moieties), sent to level I and return empty to be reloaded again. A closed cycle is a lot more complicated than this suggests. A lot of work has been done here: [http://www.molecularassembler.com/Papers/MinToolset.pdf A minimal Toolset].
+
= Old introduction =
−
For further information visit the pages about [[mechanosynthesis]] and [[tooltip chemistry]].
+
  
−
==Level 0a:==
+
The '''assembly levels''' describe how the [[assembly subsystem]] of an advanced productive nanosystem of [[technology level III]] eventually could be organized. <br>
 +
The '''assembly levels''' constitute a greatly implementation agnostic scheme for the organisation of an advanced productive nanosystem on the bottommost levels. <br>
 +
Assembly levels can be e.g. concretely mapped into a [[Nanofactory layers|layered Nanofactory design]] or a partially fractal design.
  
−
Filtering & gas / solution phase processing.
+
Since non-degradable [[waste]] may be a quite underestimated [[dangers|danger]] of this otherwise potentially extremely clean technology a special focus on [[recycling]] is taken here.
  
−
==Level 0b:==
+
* A concrete implementation of the lower assembly levels is shown in the concept visualization video [[Productive Nanosystems From molecules to superproducts]].
 +
* Assembly levels may aid in the [[design of gem-gum on-chip factories]]
 +
* Do not confuse ''[[convergent assembly]]'' with ''[[self replication|exponential assembly]]''.
 +
* The here used ''terms in italic'' are newly proposed.
  
−
Machine phase tooltip preparation. [[Tooltip chemistry]] in the [[tooltip preparation zone]].
+
= A Listing of Levels =
  
−
=Level I: (''DME synthesizing'')=
+
* PS … processing step (or PL processing level)
 +
Subclassification of PS:
 +
* PPS … preprocessing step  (or PPL preprocessing level)
 +
* AL … assembly level in the stage of assembly levels (encompassing both mills stage and manipulators stage)
 +
Subclassification of ALs:
 +
* MiL … Mill level in the stage of all mill levels
 +
* MaL … Manipulator Level in the stage of all manipulator levels
  
−
Here small '' '''[[diamondoid]] molecular''' machine and structural '''elements''' ([[diamondoid molecular elements|DMEs]]) '' are [[mechanosynthesis|mechanosynthesized]] in the [[robotic mechanosyntesis core]]s.
+
== Take-in and preprocessing ==
  
−
''[[diamondoid molecular elements|DMEs]]'' are most useful when they are designed to be reusable standard models. In any kind of nanosystem from every type (or set of types) of ''[[diamondoid molecular element|DMEs]]'' an enormous number of identical copies is needed. An example for a set of standard parts is e.g. the [[technology Level III#Minimal set of compatible DMMEs|set for minimal dynamic systems]].
+
At the very first two processing steps
−
For an efficient system lots of specialized building chambers for the different ''DMEs'' make sense. This naturally leads to a kind of ''nanofactory'' system design.
+
* there is no real constructive assembly yet
 +
* the manipulated structures do not yet grow in size
 +
Given the absence of assembly these two processing steps will be not included in the assembly levels.
  
−
'''Recycling:''' [[mechanosynthesis|Mechanosynthesis]] is not reversible. If diamond is used as building material the bound carbon can only be brought back to the biosphere by burning of the ''[[diamondoid molecular eleements|DMEs]]''. There are other [[diamondoid|diamondoid materials]] that are slightly water soluble and may allow for an unattended route back to the biosphere.
+
=== Preprocessing step 1 – Take-in of resource molecules ===
  
−
=Leve IIa: (''sinterface welding & DME assembling'')=
+
* Resource material gets filtered/cleaned. Contaminants are removed. <br>
 +
* Liquid phase (and maybe gas phase) processing is involved here. <br>
 +
* Significant heat can be generated from moving to [[machine phase]]. This energy is potentially recuperable.
  
−
Here level I ''Diamondoid Molecular Elements ([[diamondoid molecular elements|DMEs]]: DMMEs & DMSEs)'' are assembled to bigger non disassemblabel ''[[microcomponents]]''. They are built in an evacuated building chamber thus their size is limited. They are assembled covalently by pressing compatible ''[[surface interfaces|sinterfaces]]'' together and structurally by pick and place (think of putting rings on rods). To counter the thermal shaking effect (let go of a piece and it josts away instantly) which is prevalent in this size range parts which are supposed to move in the final product are held down by either VdW forces or sparsly distributed covalent bonds (predetermined breaking points) or a second gripper.
+
For more details see main page: [[Preprocessing step 1 (gem-gum factory)]] <br>
 +
Also see: [[Purification mills]], [[Acetylene molecule sorting pump]]
  
−
Finished ''[[microcomponents]]'' ready for assembly level III are complex or simple conglomerates of many small DMEs.
+
=== Preprocessing step 2 – preparation of tooltips ===
−
The step from assembly level II to III is the soonest point where product parts can be expulsed to a non vacuum environment.
+
−
Expulsion requires that all non encloded unterminated radicals that should remain in the final product must be sealed.
+
−
The consequent ban of irreversible [[surface interfaces]] makes the creation of monolithic non-modular non-reusable structures harder.
+
−
(Finished ''[[microcomponents]]'' must only use interlocking or weak VdW sticking for interconnectivity.)
+
−
[[microcomponents|Microcomponent]] expulsion sets a clear line preventing inter-mixture between assembly level II and III.
+
−
For certain products (e.g. diamond single crystals) it would be necessary to defer product expulsion to higher assembly levels.
+
−
[[metamaterials|Metamaterials]] from passivated [[microcomponents]] should be capable of fulfilling almost all our needs though.
+
  
−
[[enclosed radicals|Enclosed radicals]] may be used for [[locking mechanisms]], springs, energy- and data-storage.
+
* Discharged [[tooltip]]s get reloaded and with [[resource molecules]] from pockets of the former processing step
 +
* This step and all follwing ones happen in [[machine phase]] only.
 +
* Tip bound [[resource molecules]] get their bonds ripped open. <br>They become activated highly reacive moieties / molecule fragments
 +
* Recharged [[tooltip]]s get delivered to the next processing step which is the first assembly level.
  
−
'''Recycling:''' In this assembly level [[surface interfaces]] of ''[[diamondoid molecular elements|DMSEs]]'' are "welded" together. This step in most cases is irreversible.
+
For details see main page: [[Preprocessing step 2 (gem-gum factory)]]
−
For recycling of the whole finished ''[[microcomponents]]'' it is highly advisable to keep all the outer interlocking mechanisms reversible and to physically tag all ''[[microcomponents]]'' so that they remain recomposable later-on even after they where shuffled. Open documentation will also improve chances for reuse and thereby help to minimize biosphere pollution.
+
  
−
Since at this level only whole [[diamondoid molecular elements|DME]] blocks are handled most overhangs should be "printable" with only three degrees of freedome.
+
== First assembly level – (''from molecule fragments to crystolecules'') ==
  
−
=Level IIb: (''component tweaking'')=
+
* '''In goes:''' fully preprocessed [[moieties]] on reusable tools
 +
* '''Out goes:''' assembled [[crystolecule]]s
 +
* '''Where processing is done:''' [[robotic mechanosyntesis core]]s in specialized assembly lines.
 +
* '''What processing is done:''' [[force applying mechanosynthesis]] in [[molecular mills]] <br>very stiff bulky design of mill wheels and assembly lines – hard-coded operation
  
−
Finished level II ''[[microcomponents]]'' might provide some adjustability and or means for functional mechanical testing. General purpouse ''[[microcomponent maintainance units|maintainance units]]'' (level II & III) which remain in the final product should be able to operate these functions. And repair/replace/remove them based on the results.
+
* This is the third processing step after the the two preprocessing steps.
 +
* This is the first real assembly level where small parts are getting put together to much bigger parts.
  
−
=Level IIIa: (''component composing'')=
+
For details see main page: [[Assembly level 1 (gem-gum factory)]]
  
−
Here out of ''[[microcomponents]]'' finished in level II structures of arbitrary scale are built. Connections are made via interlocking in an ambiet pressure envirounment. Dirt like chain molecules viruses and dust must be considered. Positional accuracy may be lower than atomic. The connectors restore atomic resolution by guidance.
+
== Second assembly level  (''from crystolecules to crystolecular units'') ==
  
−
'''Recycling:''' Note that there is a tradeoff between functional-density and module-reusability. The smaller the units get the more fundamental and reusable they will be, but they'll have much interlocking surface eating up quite a lot of otherwise usable volume.
+
* '''In goes:''' fully mechanosyntheized [[crystolecule]]s without or with some bonds intentionally left open (including [[crystolecule fragments]])
 +
* '''Out goes:''' assembled [[crystolecular unit]]s (including bigger [[Diamondoid crystolecular machine element]])
 +
* '''Where processing is done:''' [[crystolecule to crystolecular unit assembly chamber]]s. Possibly mill style.
 +
* '''What processing is done:''' Pick and place assembly with various adapters for basic end-effectors. <br>Assembly including more or less of [[covalent welding]] depending on the nature of the product under construction.<br>
  
−
=Level IIIb: (''component recomposing'')=
+
For details see main page: [[Assembly level 2 (gem-gum factory)]]
  
−
General purpouse ''[[microcomponent maintainance units|maintainance units]]'' can recompose components to completely different makroproducts. Compared to "rezzing" products from level 0 this produces considerably less heat and can be done considerably faster. Hopefully a global network of ''machine phase component redistribution pipes'' will emerge at some not too late point in time.
+
== Third assembly level: (''from crystolecular units to microcomponents'') ==
  
−
=Level IV:=
+
* '''In go:''' fully assembled [[crystolecular unit]]s
 +
* '''Out go:''' assembled [[microcomponent]]s
 +
* '''Where processing is done:''' [[Level 3 assembly chamber]]s.
 +
* '''What processing is done:''' Pick and place assembly (with some adapters for basic end-effectors
  
−
An optional step. Some layers of [http://e-drexler.com/p/04/04/0507molManConvergent.html convergent assembly] can be added to boost performance.
+
For details see main page: [[Assembly level 3 (gem-gum factory)]]
 +
 
 +
== Fourth assembly level – (''from microcomponents to product fragments'') ==
 +
 
 +
'''Main page: [[From microcomponent to mesocomponent assembly level]]'''
 +
 
 +
Summarized characteristics of this assembly level:
 +
* '''In goes:''' fully assembled [[microcomponents]]
 +
* '''Out goes:''' assembled [[product fragment]]s – (or the final product right away)
 +
* '''Where processing is done:''' robotic assembly chambers (clean room)
 +
* '''What processing is done:''' Pick and place assembly with just a few if any adapters for the end-effectors. <br> Much more filigree robotics here since stiffness is no longer so critical. Eventual part streaming robotics here.
 +
 
 +
First assembly level supporting fully reversible assembly!
 +
 
 +
For details see: [[Assembly level 4 (gem-gum factory)]]
 +
 
 +
== Fifth assembly level – Level V ==
 +
 
 +
An optional step. Some layers of [http://e-drexler.com/p/04/04/0507molManConvergent.html convergent assembly] can be added fro various reasons.
 
One can think of convergent assambly as putting ''[[microcomponents]]'' together from the leaves to the root of an [https://de.wikipedia.org/wiki/Octree octree].
 
One can think of convergent assambly as putting ''[[microcomponents]]'' together from the leaves to the root of an [https://de.wikipedia.org/wiki/Octree octree].
  
Line 73: Line 113:
 
Interfaces / surfaces capable of self alignment and bonding from crude alignment by hand ([[quasi welding]]) would allow the topmost convergent assembly stages huge fault tolerances.
 
Interfaces / surfaces capable of self alignment and bonding from crude alignment by hand ([[quasi welding]]) would allow the topmost convergent assembly stages huge fault tolerances.
  
 +
'''Recycling:''' A level IIIb and IIb system may be included into the product that bypasses Level IV so that products can execute self repair actions while running. (hot plugging)
  
−
'''Recycling:''' A level IIIb and IIb system may be included into the product that bypasses Level IV so that products can execute self repair actions while running.
+
= Related topics =
  
−
Note: do not confuse ''convergent assembly'' with ''[[self replication|exponential assembly]]''.
+
== Interleaved component router systems and stocks ==
  
−
=Product Expulsion=
+
For the transport of unfinished product parts of different sizes from lower to higher [[assembly levels]]
 +
nanofactories may use [[routing layer|routing structures]].
  
−
=Notes:=
+
The routing structures can either have separate or merged multiplexing and de-multiplexing steps where the former provides redundancy of rails. (Nanosystems Fig 14.7.)
  
−
All assembly levels but IV are visible in the official productive nanosystems video [https://www.youtube.com/watch?v=mY5192g1gQg]. Note that there the airlock step(s) is/are not shown. In E.Drexlers new book "Radical Abuncance" '''[add ref]''' the outlined system differs in that it keeps the process in vacuum/noble-gas till the product is completely finished. This design avoids the complexity of dealing with dirt but introduces the complecxity of providing appropriate vacuum at all convergent assembly levels (level IV). Note that for recycling one has to deal with dirt at least on the products surface in any way. An "isolation till finished macroproduct" approach would further allow intermixing for Level II & III and thus allow for undissasemblable unrecyclable makroproducts like one big diamond crystal.
+
There are two in some respects similar yet in other respects very different steps where this can occur.
−
Such products may only be of interest for maximum performance stuff (military interest, .. ?)
+
* when [[diamondoid molecular elements]] (DMEs) are transported from assembly level I to II
 +
* when [[microcomponents]] are transported from assembly level II to III
  
−
A very important issue whenever responsibly designing nanomachinery is to aim for best waste avoidance. It does not come for free. The history of plastics show the dangers pretty well. But with [[Main Page|APM]] systems one can take a range of [[recycling|countermeasures]] starting in their inherent design and buildng up with additional functions. Very desirable would be some kind of [[global microcomponent redistribution system]] parallel to our current water supply.
+
For all the optional steps in convergent assembly (assembly level IV) the lower stages should be programmable/steerable enough that no further shuffling is required. (Depending on the programmability the lower stages may too be simplified.)
  
−
= Relation to product structure =
+
Since direct control of the bottommost systems could clog the IO bottleneck hirachical heterogenous [[nanomechanical computing]] system  must be integrated in parallel (one layer might suffice).
 +
Temporary storage facilities for microcomponents are optional (they may also be useful as seperate macroscopic entities).
 +
 
 +
[Todo: explain free space designs, analyze parallelism]
 +
 
 +
== Product expulsion ==
 +
 
 +
In any [[technology level III]] productive nanosystem that uses vacuum up to the topmost assembly level (blending assembly levels, allowing for unrecyclable macroscopic maximum performance single crystals) a macroscopic perfectly tight lockout mechanism is necessary.
 +
 
 +
Vacuum lockout in the micro-scale at the soonest possible point in the [[convergent assembly]] process like described [[vacuum handling|here]] may be easier and may enforce recyclability of products at the price that one needs to deal with dirt not just in product usage but already at the assembly time.
 +
 
 +
In E.Drexlers new book "Radical Abuncance" '''[add ref]''' the outlined system differs to the presented assembly levels in that it keeps the process in vacuum/noble-gas till the product is completely finished. This design avoids the complexity of dealing with dirt but introduces the complicity of providing appropriate vacuum at all convergent assembly levels (level IV). Note that for recycling one has to deal with dirt at least on the products surface in any way. An "isolation till finished macro-product" approach would further allow intermixing for Level II & III and thus allow for undissasemblable unrecyclable macro-products like one big diamond crystal. Such products may only be of interest for products that not just ought to work but are supposed to push the limits like in motor sports and in military interests. Well designed form closure connectors can retain almost the full material strength and may suffice for aerospace applications.
 +
 
 +
== Recycling ==
 +
 
 +
A very important issue whenever responsibly designing nanomachinery is to aim for best waste avoidance. It does not come for free. The history of plastics show the dangers pretty well. But with [[Main Page|APM]] systems one can take a range of [[recycling|countermeasures]] starting in their inherent design and buildng up with additional functions. Very desirable would be some kind of [[global microcomponent redistribution system]] parallel to our current water gas and electricity supply that couples to assembly level IIb.
 +
 
 +
== Relation to product structure ==
  
 
Somewhat complementary to the assembly levels is hirachical product structure.
 
Somewhat complementary to the assembly levels is hirachical product structure.
 
A given product description (e.g. implicit volume definition) can be reversely subdivided into assembly level assembly steps and the assembly levels can be used as a guide for foreward product design (which is most prominent with microcomponents). [TODO: link Nanosystems]
 
A given product description (e.g. implicit volume definition) can be reversely subdivided into assembly level assembly steps and the assembly levels can be used as a guide for foreward product design (which is most prominent with microcomponents). [TODO: link Nanosystems]
 +
 +
= Related =
 +
 +
* '''[[Gemstone metamaterial on chip factory]]'''
 +
* '''[[Assembly layers]]'''
 +
* '''[[Convergent assembly]]'''
 +
* [[In place assembly]]
 +
* More general including the in between levels (not necessarily layers): [[Chain of zones]]
 +
* [[Tracing trajectories of component in machine phase]]
 +
* [[Assembly level crossover (gem-gum factory)]]
 +
* [[Productive Nanosystems From molecules to superproducts]]
 +
----
 +
* [[Selfassembly level]]
 +
 +
= External links =
 +
 +
* Motivations for splitup into assembly levels (Level1 & Level2) can be found in ''Considerations for Self-replicating Manufacturing Systems by J. Storrs Hall, PhD. Institute for Molecular Manufacturing'' [http://www.autogeny.org/selfrepsys/Architectural] [http://www.foresight.org/Conferences/MNT6/Papers/Hall/]
 +
 +
[[Category:Nanofactory]]
 +
 +
== Table of assembly levels ==
 +
 +
{{Assembly levels}}
 +
 +
[[Category:PagesWithNiceTables]]

Latest revision as of 14:03, 1 March 2024

THIS IS NOT A PROPOSED DESIGN (so explicitly stated in Nanosystems). Just an example of a non-planar convergent assembly topology and geometry (or morphology as in biology). More or less planar assembly layers likely match natural scaling laws much better. (wiki-TODO: Add Josh Halls analytic math comparison to scaling laws in bio-systems too. Plus his picture.)

There are two options how things can be assembled.

  • in place right from its most fundamental constituents to its final complete form
  • out of place from smaller subcomponents to bigger subcomponents in a series of successively bigger assembly stations.

The assembly stations plus everything additionally necessary on the same size scale for integrating them into an integrated system like a gem-gum factory are here defined to be called "assembly levels".

Note: Assembly levels do not talk about specific system geometries like e.g. assembly lavers talk about a layered configuration.

Old introduction

The assembly levels describe how the assembly subsystem of an advanced productive nanosystem of technology level III eventually could be organized.
The assembly levels constitute a greatly implementation agnostic scheme for the organisation of an advanced productive nanosystem on the bottommost levels.
Assembly levels can be e.g. concretely mapped into a layered Nanofactory design or a partially fractal design.

Since non-degradable waste may be a quite underestimated danger of this otherwise potentially extremely clean technology a special focus on recycling is taken here.

A Listing of Levels

  • PS … processing step (or PL processing level)

Subclassification of PS:

  • PPS … preprocessing step (or PPL preprocessing level)
  • AL … assembly level in the stage of assembly levels (encompassing both mills stage and manipulators stage)

Subclassification of ALs:

  • MiL … Mill level in the stage of all mill levels
  • MaL … Manipulator Level in the stage of all manipulator levels

Take-in and preprocessing

At the very first two processing steps

  • there is no real constructive assembly yet
  • the manipulated structures do not yet grow in size

Given the absence of assembly these two processing steps will be not included in the assembly levels.

Preprocessing step 1 – Take-in of resource molecules

  • Resource material gets filtered/cleaned. Contaminants are removed.
  • Liquid phase (and maybe gas phase) processing is involved here.
  • Significant heat can be generated from moving to machine phase. This energy is potentially recuperable.

For more details see main page: Preprocessing step 1 (gem-gum factory)
Also see: Purification mills, Acetylene molecule sorting pump

Preprocessing step 2 – preparation of tooltips

  • Discharged tooltips get reloaded and with resource molecules from pockets of the former processing step
  • This step and all follwing ones happen in machine phase only.
  • Tip bound resource molecules get their bonds ripped open.
    They become activated highly reacive moieties / molecule fragments
  • Recharged tooltips get delivered to the next processing step which is the first assembly level.

For details see main page: Preprocessing step 2 (gem-gum factory)

First assembly level – (from molecule fragments to crystolecules)

  • This is the third processing step after the the two preprocessing steps.
  • This is the first real assembly level where small parts are getting put together to much bigger parts.

For details see main page: Assembly level 1 (gem-gum factory)

Second assembly level (from crystolecules to crystolecular units)

For details see main page: Assembly level 2 (gem-gum factory)

Third assembly level: (from crystolecular units to microcomponents)

For details see main page: Assembly level 3 (gem-gum factory)

Fourth assembly level – (from microcomponents to product fragments)

Main page: From microcomponent to mesocomponent assembly level

Summarized characteristics of this assembly level:

  • In goes: fully assembled microcomponents
  • Out goes: assembled product fragments – (or the final product right away)
  • Where processing is done: robotic assembly chambers (clean room)
  • What processing is done: Pick and place assembly with just a few if any adapters for the end-effectors.
    Much more filigree robotics here since stiffness is no longer so critical. Eventual part streaming robotics here.

First assembly level supporting fully reversible assembly!

For details see: Assembly level 4 (gem-gum factory)

Fifth assembly level – Level V

An optional step. Some layers of convergent assembly can be added fro various reasons. One can think of convergent assambly as putting microcomponents together from the leaves to the root of an octree.

Todo: Find out the advantages of convergent assembly over direct assembly. (It's not speed.) They are mentioned but not really explained here: [1] Exponential assembly is more sensitive to disturbing vibrations / accelerations than direct assembly. Proucts are more anisotropic. A lot of quick macroscopic handling (makro scale reconfigurations) may be automated in a convergent assembly nanofactory capable of dealing with dirt from recycling. Interfaces / surfaces capable of self alignment and bonding from crude alignment by hand (quasi welding) would allow the topmost convergent assembly stages huge fault tolerances.

Recycling: A level IIIb and IIb system may be included into the product that bypasses Level IV so that products can execute self repair actions while running. (hot plugging)

Related topics

Interleaved component router systems and stocks

For the transport of unfinished product parts of different sizes from lower to higher assembly levels nanofactories may use routing structures.

The routing structures can either have separate or merged multiplexing and de-multiplexing steps where the former provides redundancy of rails. (Nanosystems Fig 14.7.)

There are two in some respects similar yet in other respects very different steps where this can occur.

For all the optional steps in convergent assembly (assembly level IV) the lower stages should be programmable/steerable enough that no further shuffling is required. (Depending on the programmability the lower stages may too be simplified.)

Since direct control of the bottommost systems could clog the IO bottleneck hirachical heterogenous nanomechanical computing system must be integrated in parallel (one layer might suffice). Temporary storage facilities for microcomponents are optional (they may also be useful as seperate macroscopic entities).

[Todo: explain free space designs, analyze parallelism]

Product expulsion

In any technology level III productive nanosystem that uses vacuum up to the topmost assembly level (blending assembly levels, allowing for unrecyclable macroscopic maximum performance single crystals) a macroscopic perfectly tight lockout mechanism is necessary.

Vacuum lockout in the micro-scale at the soonest possible point in the convergent assembly process like described here may be easier and may enforce recyclability of products at the price that one needs to deal with dirt not just in product usage but already at the assembly time.

In E.Drexlers new book "Radical Abuncance" [add ref] the outlined system differs to the presented assembly levels in that it keeps the process in vacuum/noble-gas till the product is completely finished. This design avoids the complexity of dealing with dirt but introduces the complicity of providing appropriate vacuum at all convergent assembly levels (level IV). Note that for recycling one has to deal with dirt at least on the products surface in any way. An "isolation till finished macro-product" approach would further allow intermixing for Level II & III and thus allow for undissasemblable unrecyclable macro-products like one big diamond crystal. Such products may only be of interest for products that not just ought to work but are supposed to push the limits like in motor sports and in military interests. Well designed form closure connectors can retain almost the full material strength and may suffice for aerospace applications.

Recycling

A very important issue whenever responsibly designing nanomachinery is to aim for best waste avoidance. It does not come for free. The history of plastics show the dangers pretty well. But with APM systems one can take a range of countermeasures starting in their inherent design and buildng up with additional functions. Very desirable would be some kind of global microcomponent redistribution system parallel to our current water gas and electricity supply that couples to assembly level IIb.

Relation to product structure

Somewhat complementary to the assembly levels is hirachical product structure. A given product description (e.g. implicit volume definition) can be reversely subdivided into assembly level assembly steps and the assembly levels can be used as a guide for foreward product design (which is most prominent with microcomponents). [TODO: link Nanosystems]

Related

External links

  • Motivations for splitup into assembly levels (Level1 & Level2) can be found in Considerations for Self-replicating Manufacturing Systems by J. Storrs Hall, PhD. Institute for Molecular Manufacturing [2] [3]

Table of assembly levels

How products are put together
Building block Assembly step
ethyne (more commonly known as the welding gas acetylene)
methane (main compound of natural gas)
 Level 0a: (~size<1nm)
capturing sorting and purifying resource molecules
from gas phase water or organic solution
examplary: tool germylmethylene
 Level 0b: (~size~1nm)
from captured raw material Molecules (above)
to Moieties on tooltips (left)
exemplary DMSE
exemplary DMME - a very small bearing
 Level I: (~size<32nm)
from Moieties on tooltips (above)
to crystolecules (left)
Acetylene sorrting pump as an example for a monolithic block of fused DMEs
hirachically locked structures - here an infinitesimal bearing structure as an example - a structure that forms a diamondoid metamaterial
 Level IIa: (~size~32nm)
from crystolecules (above)
to more or less monolithic parts (left)
[todo: add other examples]
exemplary space filling microcomponent
 Level IIa: (~size~<1µm)
from more or less monolithic parts (above)
to recomposable µ-components (left)
A cube shaped subproduct block assembled from ~1µm sized microcomponents with truncated octahedral shape. The whole block is just a bit below the visibility limit for the human eye.
 Level III: (~size~<32µm)
from recomposable µ-components above
to µ-component assemblies (left)
how a metameterial cood look like
(imag src: www.crystalbuy.com)
how a metameterial cood look like
(imag src: casshern sins 27)
 Level III or higher: (~size>32µm)
from µ-component assemblies (above)
to diamondoid metamaterials (left)
Mock-up of a personal fabricator that currently extrudes a 3D sign. Something more practical would be e.g. a pair of shoes.
 Level III or higher: (~size>>32µm)
from metamaterials (above)
to yet alien products (left)
Retrieved from "http://apm.bplaced.net/w/index.php?title=Assembly_levels&oldid=16208"