Assembly level 3 (gem-gum factory)

From apm
Jump to: navigation, search

sinterface welding & assembly to crystolecular units


Assembly is done similarly to assembly level 2 pick&place but typically with

Since at this assembly level some exposed open bonds of surface interfaces can still be present
this assembly-step still needs to take place in practically perfect vacuum in small gas-tightly enclosed build-chambers.
Thus it would be problematic for this assembly level to be the last one of the stack since the last one
needs to open to a large macroscopic product sized open space where trace gas pollutions are much more difficult to control and prevent.

Finished microcomponents ready for the next (the third) assembly level are complex or simple conglomerates of crystolecular units (and many small crystolecules).

Products microcomponents can easily be surface-nonreactive, sealed, and ready for final expulsion in next assembly level

Open surface interfaces for covalent welding with open bonds are no longer desired.

At this (the third) assembly level the products (microcomponents) can be easily designed such that they "are sealed". That is designed such that they no longer have any on the outside exposed open bonds (including e.g. surface interfaces for seamless covalent welding). Thus the next (the fourth) assembly level (where microcomponents are the input) can potentially expulse its products to an environment containing reactive gasses (like clean air) and consequently it can be the last assembly level in the stack. This is totally optional though.

Only if the next assembly level in in air then the finished microcomponents absolutely must not use open covalent welding interfaces.

Open bonds in the final assembled microcomponent are still ok if they are fully sealed.
Such enclosed radicals may be used for locking mechanisms, springs, energy- and data-storage.


While crystolecular units have less surface interfaces than smaller crystolecules they still may have some of them.

This (the third) assembly level is the last one where some surface interfaces of
crystolecular units are welded together.
Seamless covalent welding in many cases is an irreversible assembly operation.

For recycling of the whole finished microcomponents it is highly advisable to

  • keep all the outer interlocking mechanisms reversible and to
  • physically tag all microcomponents so that they remain recomposable later-on even after they where shuffled.
  • Open documentation will also improve chances for reuse and thereby help to minimize biosphere pollution.
    See: Gemstone waste problem.

Since at this assembly level mostly whole big crystolecular units are handled
most structural overhangs (e.g. around voids) should be assemblable with only three degrees of freedom (like in an 3D printer).

High programmability is desired.
Perhaps even more so than in the next assembly step where a lot of in place production can occur.

Reversibility of the products of the third assembly level – (crystolecule component tweaking)

Finished microcomponents might be designed such that they provide:

Microcomponent maintainance microbot

These are a fully optional addition to

They could be used for

  • testing of microcomponents without disasembly
  • some reassemblies/recompositions/reconstructtions/reconfigurations of
    reversible assembled crystolecule units or even smaller crystolecules

For more details see main page: Microcomponent maintainance microbot

(wiki-TODO: move the below out to the main page linked above and integrate it there)

For operating such adjustment and testing options
general purpose maintainance microbots with
a similar size to microcomponents and some mobility (possibly legged mobility or something else)
Could remain permanently stationed within the final product.

Such Microcomponent maintenance microbots should be able able to

  • operate sub-functionalities (like functional testing) of microcomponents on the smaller crystolecular unit and crystolecule size scale (3rd and 2nd assembly level actions).
  • disconnect and pull out as-broken-detected microcomponents and push in and connect new replacement microcomponents
  • eventually do some repair of microcomponents without replacing them as a whole (difficult 2nd assembly level actions).

In other words Microcomponent maintenance microbots could:

  • repair/replace/remove microcomponents based on the results of some tests they perform on them.
  • operate with assembly capabilities on the fourth assembly level (manipulatiing their own size) the third and perhaps even second assembly level.