Difference between revisions of "Hyper high throughput microcomponent recomposition"
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* The microcomponents that are to be assembled must already be available in a pre-produced state. | * The microcomponents that are to be assembled must already be available in a pre-produced state. | ||
* If product removal can't be made faster than the assembly motions then one gets hard limited by the [[macroscale slowness bottleneck]] <br>For more details on this see the explanation on the page: [[Producer product pushapart]] | * If product removal can't be made faster than the assembly motions then one gets hard limited by the [[macroscale slowness bottleneck]] <br>For more details on this see the explanation on the page: [[Producer product pushapart]] | ||
| − | * Also at the point at which transport speeds (not frequencies) overtake assembly speeds the scaling law of [[higher throughput of smaller machinery]] breaks down. <br>See page "[[optimal sublayernumber for minimal friction]]" for the math behind this. <br> Some more can be squeezed out by reducing transport friction below assembly friction by a large margin and eventually straight line levitation shoot-out. | + | * Also at the point at which transport speeds (not frequencies) overtake assembly speeds the scaling law of [[higher throughput of smaller machinery]] breaks down. <br>See page "[[optimal sublayernumber for minimal friction]]" for the math behind this. <br> Some more can be squeezed out by reducing transport friction below assembly friction by a large margin and eventually straight line levitation shoot-out. <br>Hard to do large scale monolithic products that way though. |
== The needed cooling monstrosity == | == The needed cooling monstrosity == | ||
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Going to the absolute limits cooling devices may become much bigger than the actual production devices. <br> | Going to the absolute limits cooling devices may become much bigger than the actual production devices. <br> | ||
May even the friction of the cooling capsules that are shot through become relevant?? | May even the friction of the cooling capsules that are shot through become relevant?? | ||
| + | |||
| + | Related page: [[The limits of cooling]] | ||
== It's not a factory, it's a thing shooting rocket/gun! == | == It's not a factory, it's a thing shooting rocket/gun! == | ||
| Line 44: | Line 46: | ||
== Related == | == Related == | ||
| − | * [[ | + | * '''[[On chip microcomponent recomposer]]''' unlike this highly speculative page here that page is meant to be taken more seriously |
| + | * Other systems: [[Microcomponent recomposer (disambiguation)]] | ||
| + | ---- | ||
* [[Higher throughput of smaller machinery]] | * [[Higher throughput of smaller machinery]] | ||
| + | * [[High performance of gem-gum technology]] | ||
* [[Level throughput balancing]] | * [[Level throughput balancing]] | ||
| − | |||
* [[Producer product pushapart]] | * [[Producer product pushapart]] | ||
| + | ---- | ||
| + | * [[The challenge of high speeds near nanoscale]] | ||
Latest revision as of 19:26, 15 September 2024
Microcomponent recomposers might be able to feature astounding to frightening levels of throughput capability.
Due to:
- (1/2) the scaling law of higher throughput of smaller machinery and ...
- (2/2) the lower energy turnover and higher efficiency of microcomponent recomposition compared to piezochemical mechanosynthesis
The maximum of throughput-performance is likely expectable for the smallest size scale where
- the energy turnover is not yet excessive
- bearing surface area is not increased – Note: in first approximation of convergent assembly total bearing surface area does NOT grow going down the assembly layers!!
And this would be microcomponent recomposition processes.
This may lead to astounding and (if not handled properly) even dangerous levels of throughput.
Contents
Main restrictions
- The microcomponents that are to be assembled must already be available in a pre-produced state.
- If product removal can't be made faster than the assembly motions then one gets hard limited by the macroscale slowness bottleneck
For more details on this see the explanation on the page: Producer product pushapart - Also at the point at which transport speeds (not frequencies) overtake assembly speeds the scaling law of higher throughput of smaller machinery breaks down.
See page "optimal sublayernumber for minimal friction" for the math behind this.
Some more can be squeezed out by reducing transport friction below assembly friction by a large margin and eventually straight line levitation shoot-out.
Hard to do large scale monolithic products that way though.
The needed cooling monstrosity
Going to the absolute limits cooling devices may become much bigger than the actual production devices.
May even the friction of the cooling capsules that are shot through become relevant??
Related page: The limits of cooling
It's not a factory, it's a thing shooting rocket/gun!
If product extraction channels ...
- are well supported (big chamber to part size ratio and thick walls) and
- do not curve but go straight
... then product removal speeds can exceed the unsupported rotating ring speed limit. That is: exceed ~3km/s
This sounds more like a rocket engine than a production device ... lunatic ...
So you better do that in vacuum!
In space:
- Where to get all the pre-producted microcomponents from?
- What about the intense recoil? "Producing" both ways? (it's more like "produshooting")
On the ground:
- How to catch the products safely?!
- The whole cooling and catching stuff will likely be bigger than producing the stuff more slowly but with more devices.
So what about just producing stuff at sane speeds ...
Related
- On chip microcomponent recomposer unlike this highly speculative page here that page is meant to be taken more seriously
- Other systems: Microcomponent recomposer (disambiguation)
- Higher throughput of smaller machinery
- High performance of gem-gum technology
- Level throughput balancing
- Producer product pushapart
