Microcomponent tagging

From apm
Jump to: navigation, search
This article defines a novel term (that is hopefully sensibly chosen). The term is introduced to make a concept more concrete and understand its interrelationship with other topics related to atomically precise manufacturing. For details go to the page: Neologism.

Contrary to small DMEs diamondoid microcomponents can provide enough space to carry structures for their identification around.

To keep it compact one may only include links to more information.

Relevant informatios about microcomponents are e.g.:

  • types and compatibility informations - With this microcomponents that became shuffled somehow can be sorted and recycled.
  • absolute maximum ratings like: e.g.
  • allowed temperature range - see: "consistent design for external limiting factors"
  • predetermined ultimate strength of interfaces (nondestructive overload cleavage may be supported)

A robust simple and easy to handle tag could be a grid of square or hexagonal areas indented to different depths on an outer surface (vaguely similar to QR codes). (Testing peg readout mechanisms ...)

If desired one can additionally to a "normal" info tag even go as far as to give each and every microcomponent a unique identification number - without much effort. Other individual information would be e.g. the creation time.

With rewritable data storage dynamic per microcomponent information can be stored like:

  • number of reuses in different products - one could even include clocks that can count for ridiculously long time in the small space of a single microcomponent
  • estimated damage of the microcomponent - relevant for self repairing systems
  • contamination: whether the component had contact to the external world and thus might have dirt sticking on it

Adding more possibly rewritable data storage capability onto or into a microcomponent one ends up with a data storage cell. Diamondoid structures (in the sense of stiff rods) do not necessarily have the highest possible data densities but have high thermal stability.

Finer AP structures like alternating passivation with hydrogen and fluorine or more advanced atomically precise semi diamondoid structures might be used for maximum density data storage but will be more susceptible to data loss by damage.


External Links