Design of gem-gum on-chip factories

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technology level III

raw notes:

  • level throughput balancing
  • (folding)
  • level0 splitup in hot and cold section
  • power dissipation bottleneck - dynamic drag & breaking losses
  • 3D fractal speedup
  • cooling & isolation

Although diamondoid mechanosynthesis works at room temperature cryogenic cooling will probably be employed just because it seems rather easy to do (see: "Diamondoid heat pump system") and error rates can be shrunken by many orders of magnitude.

Depending on whether general purpose mechanosynthetic fabricators or mill style fabricators (serial chain of tools with no spaces) are used predominantly more or less layers and channels for threading parts by are needed [?].

  • slow speed of assembly level 0: The mechanisms to assemble parts normally can potentially be smaller than the parts being assembled. Since The mechanisms to assemble minimal sized DMEs need themselves to be DMEs the mechanisms must have a similar size as the products they assemble. Since only a vew atoms are added per assembly step the density of actual building sites of atomic size is rather low and consequently mechanisms at the bottommost layers are quite a bit slower than the ones above and need to be included in greater numbers.
  • If assembly units of an assembly level produce (pre-)products slower than the size-characteristic frequency the next higher assembly level demands one can stack assembly units and thread by finished (pre-)products. Assembly units can be stacked as long as the size characteristic frequency of the threading by mechanics is not exceeded.
  • The ultimate performance limit is determined by the accepted dissipation heat at the lower levels the maximal acceptable accelerations at the higher convergent assembly levels. Designs leading to practical speeds at human scale lie way below the performance limits.
  • Layer and stage ratios: In any convergent assembly step a step size can be chosen. Big steps limit the maximum possible speed of the considered assembly level step but makes planning and programming more flexible and easier.
  • In any convergent assembly step one can choose from the different robotic manipulators to do the assembly. Mill style can (with the exception of the bottommost asselmbly level) have the smaller size and higher characteristic operation frequency of the lower assembly level. Single manipulator style assembly have the bigger size and smaller characteristic frequency of the upper assembly level. (Intermediate forms are possible). The choice depends on whether programmability or speed is the the primary concern.

Component router systems

For the transport of unfinished product parts of different sizes from lower to higher assembly levels nanofactories may use routing structures.

The routing structures can either have separate or merged multiplexing and de-multiplexing steps where the former provides redundancy of rails. (Nanosystems Fig 14.7.)

There are two in some respects similar yet in other respects very different steps where this can occur.

For all the optional steps in convergent assembly (assembly level IV) the lower stages should be programmable/steerable enough that no further shuffling is required. (Depending on the programmability the lower stages may too be simplified.)

Since direct control of those systems would clog the IO bottleneck hirachical heterogenous nanomechanical computing system must be integrated in parallel (one layer might suffice). Temporary storage facilities for microcomponents are optional and may be more useful as seperate macroscopic entity.

[Todo: explain free space designs, analyze parallelism]

External links

Articles from E. Drexlers Blog:

External references

  • Nanosystems chapter 14
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