Difference between revisions of "Physical debugging"
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Revision as of 19:29, 3 March 2015
The inherent massive parallelism it gives an opportunity to quickly check for basic design faults (weak spots).
Enrichment of damaged parts
If damage can be detected (e.g. suck movement, unresponsive, erronous responsive, ... ) one can "purify/enrich" the failing microcomponents for either their disposal or their analysis. To do so one can take the whole product apart with a nanofactory or with a microcomponent recomposer and possibly put it together again afterwards with the failed parts replaced. Alternatively microcomponent maintainance units can be used to extract the damaged microcomponens in an in place self repairing system (hot swapping).
Intermixed radiation damage
In a macroscopic product damage from ambient radiation is quickly ocurring. This doesnt bother a well designet product with integrated redundancy. It might be tricky to seperate radiation damage from other damage which is needed unless one is interested in the effects of radiation damage.
Visualisation with electron microscopy
Microcomponents could be stretched out in a single layer for imaging in an transmission electron microscope. They are quite thick and may be rather heterogeneous inside though.
