Difference between revisions of "Physical debugging"
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== Enrichment of damaged parts == | == Enrichment of damaged parts == | ||
| − | If damage can be detected (e.g. suck movement, unresponsive, erronous responsive, ... ) with simple low level in place analytics one can "purify/enrich" the failing [[microcomponent]]s for either their disposal or their analysis. To do so one can take the whole product apart with a [[nanofactory]] or with a [[microcomponent recomposer device]] and possibly put it together again afterwards with the failed parts replaced. Alternatively [[microcomponent | + | If damage can be detected (e.g. suck movement, unresponsive, erronous responsive, ... ) with simple low level in place analytics one can "purify/enrich" the failing [[microcomponent]]s for either their disposal or their analysis. To do so one can take the whole product apart with a [[nanofactory]] or with a [[microcomponent recomposer device]] and possibly put it together again afterwards with the failed parts replaced. Alternatively [[microcomponent maintenance microbot]]s can be used to extract the damaged microcomponens in an in place [[self repairing system|self repair]]ing system (hot swapping). |
== Intermixed radiation damage == | == Intermixed radiation damage == | ||
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* Cryo-electron tomography: [https://en.wikipedia.org/wiki/Cryo-electron_tomography (leave to wikipedia)] | * Cryo-electron tomography: [https://en.wikipedia.org/wiki/Cryo-electron_tomography (leave to wikipedia)] | ||
* testing for functionality | * testing for functionality | ||
| − | * [[Microcomponent maintenance | + | * [[Microcomponent maintenance microbot]]s |
[[Category:Information]] | [[Category:Information]] | ||
Revision as of 13:58, 23 May 2021
The inherent massive parallelism of macroscopic atomically precise products gives an opportunity to quickly check for basic design faults (weak spots).
Contents
Enrichment of damaged parts
If damage can be detected (e.g. suck movement, unresponsive, erronous responsive, ... ) with simple low level in place analytics one can "purify/enrich" the failing microcomponents for either their disposal or their analysis. To do so one can take the whole product apart with a nanofactory or with a microcomponent recomposer device and possibly put it together again afterwards with the failed parts replaced. Alternatively microcomponent maintenance microbots can be used to extract the damaged microcomponens in an in place self repairing system (hot swapping).
Intermixed radiation damage
In a macroscopic product damage from ambient radiation is quickly ocurring. This doesnt bother a well designet product with integrated redundancy. It might be tricky to seperate radiation damage from other damage which is needed unless one is interested in the effects of radiation damage.
High level "laboratory" analytics
Visualisation with electron microscopy
Microcomponents could be stretched out in a single layer for imaging in an transmission electron microscope. They are quite thick and may be rather heterogeneous inside though so one wouldn't see much. Microcomponents may be designed to be further disassemblable - at this point it is ok if this is irreversible since the part is already broken.
Related
- General software issues
- Cryo-electron tomography: (leave to wikipedia)
- testing for functionality
- Microcomponent maintenance microbots
