Difference between revisions of "Dangers"

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m (List of possible dangers that could arise with the rise of advanced AP technology)
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* non degrading waste [[recycling]] (envirounment)
 
* non degrading waste [[recycling]] (envirounment)
* building up on flawed software design
+
* building up on flawed software design ([[wikipedia:Technical debt]])
 
* vulnerability to malicious software. (See: [[self limitation for safety]], ..)
 
* vulnerability to malicious software. (See: [[self limitation for safety]], ..)
 
* risky [[geoengineering]] going wrong.
 
* risky [[geoengineering]] going wrong.

Revision as of 23:06, 7 March 2015

The opportunities that AP technology will bring should hopefully by far outbalance the dangers presented here.

List of possible dangers that could arise with the rise of advanced AP technology

Waste

Albeit advanced APM has the potential to be an absolutely clean technology in production (since its primary waste products are only hot air and warm water) advanced APM would be a unprecedented wasteful technology in disposal if not built correctly since the products themselves must be considered waste once they become obsolete - and the products will become obsolete fast as we can see with today's pace of software improvement. Also the global production rate in mass or volume will be bigger since production will become so widespread and accessible.

  • Recycling is not an option its an obligation that has to be thought of before creating advanced APM systems that can produce products that don not biodegrade quickly.

Related

  • recomposable microcomponents
  • The two recycling classes of products: The ones that can be completely burned to gasses (C,H,O,N,S) &
    The ones that produce slacks when burned (containing too: Si,Al,Ti,Fe,Na, and the wole remaining periodic table). See: Diamondoid waste incineration.
  • amorphous slack of various elements is hard to deal with since blind atomically precise disassembly of unknown structures is a very hard problem.
  • there's no AP disassembly (at least its a lot harder to do than AP assembly)