Difference between revisions of "Microcomponent tagging"
(Created page with " Contrary to small DMEs diamondoid microcomponents can provide enough space to carry structures for their identification around. To ...") |
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Relevant informatios about microcomponents are e.g.: | Relevant informatios about microcomponents are e.g.: | ||
* types and compatibility informations - With this microcomponents that became shuffled somehow can be sorted and [[recycling|recycled]]. | * types and compatibility informations - With this microcomponents that became shuffled somehow can be sorted and [[recycling|recycled]]. | ||
| − | * absolute maximum ratings like e.g. allowed temperature range - see: "[[consistent design for external limiting factors]]" | + | * absolute maximum ratings like: e.g. |
| + | * allowed temperature range - see: "[[consistent design for external limiting factors]]" | ||
| + | * predetermined ultimate strength of interfaces (nondestructive overload cleavage may be supported) | ||
A robust simple and easy to handle tag could be a grid of square or hexagonal areas indented to different depths on an outer surface (vaguely similar to QR codes). (Testing peg readout mechanisms ...) | A robust simple and easy to handle tag could be a grid of square or hexagonal areas indented to different depths on an outer surface (vaguely similar to QR codes). (Testing peg readout mechanisms ...) | ||
| − | If desired one can additionally to a "normal" info tag even go as far as to give each and every microcomponent a unique identification number. | + | If desired one can additionally to a "normal" info tag even go as far as to give each and every microcomponent a unique identification number - without much effort. Other individual information would be e.g. the creation time. |
| − | Other individual information would be e.g. the creation time. | + | |
With rewritable data storage dynamic per microcomponent information can be stored like: | With rewritable data storage dynamic per microcomponent information can be stored like: | ||
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Adding more possibly rewritable data storage capability onto or into a microcomponent one ends up with a [[data storage cell]]. | Adding more possibly rewritable data storage capability onto or into a microcomponent one ends up with a [[data storage cell]]. | ||
| + | Diamondoid structures do not necessarily have the highest possible data densities but have high thermal stability. | ||
| + | |||
| + | Finer AP structures like alternating passivation with hydrogen and fluorine or more advanced [[quasi floppy AP structures]] might be used for maximum density data storage but will be more susceptible to data loss by damage. | ||
Revision as of 20:01, 18 January 2014
Contrary to small DMEs diamondoid microcomponents can provide enough space to carry structures for their identification around.
To keep it compact one may only include links to more information.
Relevant informatios about microcomponents are e.g.:
- types and compatibility informations - With this microcomponents that became shuffled somehow can be sorted and recycled.
- absolute maximum ratings like: e.g.
- allowed temperature range - see: "consistent design for external limiting factors"
- predetermined ultimate strength of interfaces (nondestructive overload cleavage may be supported)
A robust simple and easy to handle tag could be a grid of square or hexagonal areas indented to different depths on an outer surface (vaguely similar to QR codes). (Testing peg readout mechanisms ...)
If desired one can additionally to a "normal" info tag even go as far as to give each and every microcomponent a unique identification number - without much effort. Other individual information would be e.g. the creation time.
With rewritable data storage dynamic per microcomponent information can be stored like:
- number of reuses in different products
- estimated damage of the microcomponent - relevant for self repairing systems
Adding more possibly rewritable data storage capability onto or into a microcomponent one ends up with a data storage cell. Diamondoid structures do not necessarily have the highest possible data densities but have high thermal stability.
Finer AP structures like alternating passivation with hydrogen and fluorine or more advanced quasi floppy AP structures might be used for maximum density data storage but will be more susceptible to data loss by damage.
