Difference between revisions of "Bunching"
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A stack of thin [[assembly layers]] may not always be the optimal arrangement for [[assembly levels]]. <br> | A stack of thin [[assembly layers]] may not always be the optimal arrangement for [[assembly levels]]. <br> | ||
Especially when [[transport]], [[recycling]], and [[caching]] becomes involved and thermal aspects are considered. | Especially when [[transport]], [[recycling]], and [[caching]] becomes involved and thermal aspects are considered. | ||
Latest revision as of 12:43, 27 May 2021
A stack of thin assembly layers may not always be the optimal arrangement for assembly levels.
Especially when transport, recycling, and caching becomes involved and thermal aspects are considered.
Similar so for gem-gum product systems (gem-gum technology other than gem-gum factories)
Bunching shall here refer to when deviating from stratified layer designs.
E.g. to more cube like blocky systems with cable like connections.
Bunching different functionalities separately together in space.
Maybe it's a bit like the global microcomponent redistribution system somewhat intermixing with assembly levels and subsystems of gem-gum factories? ...
Related
- On chip microcomponent recomposer - Thermal bunching
- Thermally driven folding – Bunching of stages by temperature
- How small scale friction shapes advanced transport
