Difference between revisions of "Consistent design for external limiting factors"
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Stability of free or mutual or environmentally contacting passivated surfaces will reduce allowed temperatures well below the bulk material melting points though. | Stability of free or mutual or environmentally contacting passivated surfaces will reduce allowed temperatures well below the bulk material melting points though. | ||
| − | * [//en.wikipedia.org/wiki/Titanium_carbide TiC] ( | + | 4th period: |
| − | * | + | * [//en.wikipedia.org/wiki/Titanium_carbide TiC] (abundant elements) |
| − | * [//en.wikipedia.org/wiki/Zirconium_carbide ZrC] | + | * [//en.wikipedia.org/wiki/Vanadium_carbide VC] (2810 °C; 9-9.5 Mohs) |
| + | * [//en.wikipedia.org/wiki/Chromium_carbide Cr<sub>3</sub>C<sub>2</sub>; Cr<sub>7</sub>C<sub>3</sub>; Cr<sub>23</sub>C<sub>6</sub>] (1,895 °C; 3,443 °F; 2,168 K) | ||
| + | 5th period: | ||
| + | * [//en.wikipedia.org/wiki/Zirconium_carbide ZrC] (3532 °C; extremely hard; highly corrosion resistant; very metallic) | ||
| + | * [http://en.wikipedia.org/wiki/Niobium_carbide Nb<sub>2</sub>C] (3490 °C; extremely hard; highly corrosion resistant) | ||
| + | 6th period: | ||
* [//en.wikipedia.org/wiki/Hafnium_carbide HfC] | * [//en.wikipedia.org/wiki/Hafnium_carbide HfC] | ||
| − | * [//en.wikipedia.org/wiki/Tantalum_hafnium_carbide Ta<sub>4</sub>HfC<sub>5</sub>] (record holder) | + | * [//en.wikipedia.org/wiki/Tantalum_hafnium_carbide Ta<sub>4</sub>HfC<sub>5</sub>] (record holder: 4,215 °C; 7,619 °F; 4,488 K) |
Revision as of 13:59, 12 January 2014
External limiting factors can be:
- thermal
- radiation
- acceleration
- pressure
Microcomponents could be tagged with links to informations on allowed ranges.
thermal
The allowed temperature range of a whole system (on a thermally equilibrated micro-scale) is defined by the intersection of all the allowed temperature ranges of the system components. When using technology of brownian technology path in e.g. technology level III either in the process of reaching it or when re-merging after reaching it the machine phase (e.g. entropic batteries) AP Technology will acquire an accordingly restricted range of allowed operation temperature range especially much of the otherwise down to zero kelvin completely allowed low temperature regime will be cut off.
It is advisable to keep track off all the allowed temperature ranges for system components (no matter which technology path) and keep the technology path branches (with vastly different allowed temperature ranges) as separate as possible.
Diamond is metastable and can turn into graphite at too high temperatures. Other diamondoid materials like the carbides of the titanium vanadium and chromium group can be used for high temperature applications (complete sets of DMEs are needed). Stability of free or mutual or environmentally contacting passivated surfaces will reduce allowed temperatures well below the bulk material melting points though.
4th period:
- TiC (abundant elements)
- VC (2810 °C; 9-9.5 Mohs)
- Cr3C2; Cr7C3; Cr23C6 (1,895 °C; 3,443 °F; 2,168 K)
5th period:
- ZrC (3532 °C; extremely hard; highly corrosion resistant; very metallic)
- Nb2C (3490 °C; extremely hard; highly corrosion resistant)
6th period:
