Mechanosynelf assembly assemblinting system

Concrete description

Here is a slightly concrete crude wild idea example scenario:

Assuming a foldamer based scaffold anchored down onto a flat chip surface
(could well be as weak and wobbly as 3D structural DNA nanotechnology)
with some very simple moving swinging arms. As simple as possible, think "stick on hinge".
allowing to transport pre-selfassembled foldamer bricks by successive handover freely on a 2D grid.
Two orientation of hinges.
Bricks can be structural DNA, or protein, or some other foldamers or stiffer spiroligomers).
Later eventually more advanced stuff like crystolecules.

Then when several parts are at target sites/pixels
(Perhaps one part for each pixel even? But not at all necessarily so! One can go several rounds for each layer.)
then an opposing chip is made to approach at the right lateral alignment towards the right distance and
thermally driven self assembly does the last mile "tether assisted positional assembly".

The opposing chip has a self-assembled build-plate pegboard
or an already partially built up product structure.

Operation would look a bit like a resin 3D printer
the target chip plate moving back and forth with
the opposing chip surfaces gradually increasing distance with increasing thickness of the so far built up part.

Suitability of even very low stiffness structural DNA nanotechnology

As for structural DNA nanotechnology:
★ Many micron large slabs of addressable SDN "pegboards" have already been made.
★ The lack of proper termination control causing sideways frayed fringes may be acceptable here.
★ The repeating period of addressing space is also quite big compared to positional capabilities for chips.

Expectable challenges

Clallenges roughly include:
★ The self-assembly of the scaffolds pegboard grids for source and target side.
★ Self assembly of the transort mechanisms. As simple as possible. Think "stick on a hinge" that can be made to flap two ways.
★ The pre-self-assembly of foldamer brick structures.
★ Initial feeding with of the source grid with these bricks with known types on known locations.
★ Attaching and detaching bricks on handover and on final deposition to the product.
★ Some very minimalistic nanomechaniocal demultiplexing
… compensating for the large electrodes very likely not being able to address the transport mechanisms individually
★ Accessibility for measurements: The target plate being transparent glass for confocal microscopy maybe?
★ Product extraction, analysis, and eventual use fro some application.
… Cryo EM on single structures usually needs stain and gives much cruder images than using ensembles.
… "Print" several and use these as orientation aligned ensemble?
★ no claim to completeness

Escaping via the incremental path portal between the two blockades

For this approach to make sense the pre-self-assembled parts need to be the right size.
★ Big enough to be above the positional assembly redundancy blockade
★ Small enough to be still be under the thermal driven selfassembly diffusion speed slowdown blockade

Initially this would be all about escaping the "upward outward" scaling corridor. This would not yet be about moving to better materials along the technology levels. Scaling "downward inward".

(wiki-TODO: add the graphic here)

Abstract description

This idea here could be classified as one special sub-type
of the general more class of modular molecular composite nanosystems
that is specifically targeting at tether assisted positional assembly.

This would be about implementing the weakest possible form of
mechanosynthesis that is not even fully establishing machine phase yet.
Just establishing very wide motion corridors.
The positional assembly kinematic loop can still be very loose and
has not very high demands on positional accuracy yet.

Related

• Modular molecular composite nanosystems
• Tether assisted positional assembly & Mechanosyntelf assembly
• structural DNA nanotechnology

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• positional assembly redundancy blockade
• thermal driven selfassembly diffusion speed slowdown blockade