Mechanosynelf assembly assemblinting system: Difference between revisions
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'''Motivation for the exotic naming choice here:'''<br> | |||
★ '''Mechanosynelf:''' Smack in the middle between weak non force applying '''[[mechanosynthesis]]''' and '''[[self assembly]]''' <br> | |||
★ '''Assemblinting:''' It is brickby brick '''assem'''bly but it very much would looks like resing 3D pr'''inting''' <br> | |||
== Concrete description == | |||
'''Here is a slightly concrete crude wild idea example scenario:''' <br> | '''Here is a slightly concrete crude wild idea example scenario:''' <br> | ||
| Line 32: | Line 28: | ||
the target chip plate moving back and forth with <br> | the target chip plate moving back and forth with <br> | ||
the opposing chip surfaces gradually increasing distance with increasing thickness of the so far built up part. <br> | the opposing chip surfaces gradually increasing distance with increasing thickness of the so far built up part. <br> | ||
== Suitability of even very low stiffness structural DNA nanotechnology == | |||
As for [[structural DNA nanotechnology]]: <br> | As for [[structural DNA nanotechnology]]: <br> | ||
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★ The repeating period of addressing space is also quite big compared to positional capabilities for chips. <br> | ★ The repeating period of addressing space is also quite big compared to positional capabilities for chips. <br> | ||
== Expectable challenges == | |||
'''Clallenges roughly include:''' <br> | '''Clallenges roughly include:''' <br> | ||
| Line 58: | Line 52: | ||
★ no claim to completeness <br> | ★ no claim to completeness <br> | ||
== | == Escaping via the incremental path portal between the two blockades == | ||
[[File:APM-EarlyDevelopmentPaths.jpg|500px|thumb|right|See the two red starts? These are the two blockades for the [[incremental path]] variants. The idea '''here''' is to escape via the portal between the red stars by picking the right size of pre-self-assembled foldamers (also structural DNA or proteins of whatever) for [[Tether assisted positional assembly]].]] | |||
For this approach to make sense the pre-self-assembled parts need to be the right size. <br> | |||
★ Big enough to be above the [[positional assembly redundancy blockade]] <br> | |||
★ Small enough to be still be under the [[thermal driven selfassembly diffusion speed slowdown blockade]] <br> | |||
Initially this would be all about escaping the "upward outward" scaling corridor. | |||
This would not yet be about moving to better materials along the [[technology levels]]. Scaling "downward inward". | |||
== Abstract description == | |||
This idea here could be classified as one special sub-type <br> | |||
of the general more class of [[modular molecular composite nanosystems]] <br> | |||
that is specifically targeting at tether assisted positional assembly. <br> | |||
This would be about implementing the weakest possible form of <br> | |||
[[mechanosynthesis]] that is not even fully establishing [[machine phase]] yet. <br> | |||
Just establishing very wide motion corridors. <br> | |||
The [[positional assembly kinematic loop]] can still be very loose and <br> | |||
has not very high demands on positional accuracy yet. | |||
= Related = | |||
* [[Tether assisted positional assembly]] & [[Mechanosynelf assembly]] | |||
* [[Mechanosynthesis (disambiguation)]] & [[Mechanosynthesis]] | |||
* [[Thermally driven selfassembly]] | |||
* [[Structural DNA nanotechnology]] | |||
---- | |||
* [[Positional assembly redundancy blockade]] | |||
* [[Thermal driven selfassembly diffusion speed slowdown blockade]] | |||
---- | |||
* [[Modular molecular composite nanosystems]] | * [[Modular molecular composite nanosystems]] | ||
* [[ | * [[Mixed path]] | ||
* [[Early diamondoid nanosystem pixel (direct path)]] | |||
* [[ | |||
Latest revision as of 01:12, 6 June 2026
Motivation for the exotic naming choice here:
★ Mechanosynelf: Smack in the middle between weak non force applying mechanosynthesis and self assembly
★ Assemblinting: It is brickby brick assembly but it very much would looks like resing 3D printing
Concrete description
Here is a slightly concrete crude wild idea example scenario:
Assuming a foldamer based scaffold anchored down onto a flat chip surface
(could well be as weak and wobbly as 3D structural DNA nanotechnology)
with some very simple moving swinging arms. As simple as possible, think "stick on hinge".
allowing to transport pre-selfassembled foldamer bricks by successive handover freely on a 2D grid.
Two orientation of hinges.
Bricks can be structural DNA, or protein, or some other foldamers or stiffer spiroligomers).
Later eventually more advanced stuff like crystolecules.
Then when several parts are at target sites/pixels
(Perhaps one part for each pixel even? But not at all necessarily so! One can go several rounds for each layer.)
then an opposing chip is made to approach at the right lateral alignment towards the right distance and
thermally driven self assembly does the last mile "tether assisted positional assembly".
The opposing chip has a self-assembled build-plate pegboard
or an already partially built up product structure.
Operation would look a bit like a resin 3D printer
the target chip plate moving back and forth with
the opposing chip surfaces gradually increasing distance with increasing thickness of the so far built up part.
Suitability of even very low stiffness structural DNA nanotechnology
As for structural DNA nanotechnology:
★ Many micron large slabs of addressable SDN "pegboards" have already been made.
★ The lack of proper termination control causing sideways frayed fringes may be acceptable here.
★ The repeating period of addressing space is also quite big compared to positional capabilities for chips.
Expectable challenges
Clallenges roughly include:
★ The self-assembly of the scaffolds pegboard grids for source and target side.
★ Self assembly of the transort mechanisms. As simple as possible. Think "stick on a hinge" that can be made to flap two ways.
★ The pre-self-assembly of foldamer brick structures.
★ Initial feeding with of the source grid with these bricks with known types on known locations.
★ Attaching and detaching bricks on handover and on final deposition to the product.
★ Some very minimalistic nanomechaniocal demultiplexing
… compensating for the large electrodes very likely not being able to address the transport mechanisms individually
★ Accessibility for measurements: The target plate being transparent glass for confocal microscopy maybe?
★ Product extraction, analysis, and eventual use fro some application.
… Cryo EM on single structures usually needs stain and gives much cruder images than using ensembles.
… "Print" several and use these as orientation aligned ensemble?
★ no claim to completeness
Escaping via the incremental path portal between the two blockades

For this approach to make sense the pre-self-assembled parts need to be the right size.
★ Big enough to be above the positional assembly redundancy blockade
★ Small enough to be still be under the thermal driven selfassembly diffusion speed slowdown blockade
Initially this would be all about escaping the "upward outward" scaling corridor. This would not yet be about moving to better materials along the technology levels. Scaling "downward inward".
Abstract description
This idea here could be classified as one special sub-type
of the general more class of modular molecular composite nanosystems
that is specifically targeting at tether assisted positional assembly.
This would be about implementing the weakest possible form of
mechanosynthesis that is not even fully establishing machine phase yet.
Just establishing very wide motion corridors.
The positional assembly kinematic loop can still be very loose and
has not very high demands on positional accuracy yet.
Related
- Tether assisted positional assembly & Mechanosynelf assembly
- Mechanosynthesis (disambiguation) & Mechanosynthesis
- Thermally driven selfassembly
- Structural DNA nanotechnology
- Positional assembly redundancy blockade
- Thermal driven selfassembly diffusion speed slowdown blockade