Difference between revisions of "Assembly level 4 (gem-gum factory)"

Revision as of 09:45, 21 May 2022

The fourth assembly level is the soonest point where product parts can be expulsed to a non vacuum environment.

seamless covalent welding of surface interfaces is no longer an option. For interconnectivity only use:

• form closure interlocking or
• "weak" VdW sticking

With an early transition to an air filled environment the creation of monolithic structures becomes harder or even impossible. But:

• Such structures provide only minor and questionable advantage in absolute tensile strengths. Form closure fir tree interfaces can preserve a goof deal of the absolute tensile strength bulk material and provide spots stopping cracks.
• Such structures are non-modular and non-reusable, so not very desirable anyway.

Only for certain very peculiar products (including e.g. a macroscopic single crystals) it would be necessary to defer product expulsion to higher assembly levels.
Metamaterials from passivated microcomponents should be capable of fulfilling almost all our needs though.
Microcomponent expulsion marks a clear line preventing inter-mixture between the second and the third assembly level.

(wiki-TODO: finish this page)