Difference between revisions of "Cooling"
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Cooling is both relevant in both | Cooling is both relevant in both | ||
* mundane and important practical systems and | * mundane and important practical systems and | ||
* especially in systems that aim to go to the absolute limits of what is possible | * especially in systems that aim to go to the absolute limits of what is possible | ||
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The latter by nature goes in quite speculative territory as <br> | The latter by nature goes in quite speculative territory as <br> | ||
| − | it | + | it is not compatible with [[conservative estimation]] and [[exploratory engineering]]. <br> |
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| + | The latter relates to a common misconception about the limits of power density: <br> | ||
| + | Taking stated numbers too literally | ||
| + | See page: [[Limits of power density imposed by limits of cooling]] | ||
== Practical cooling in [[gem-gum factories]] == | == Practical cooling in [[gem-gum factories]] == | ||
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Liquid helium temperatures are likely overkill. <br> | Liquid helium temperatures are likely overkill. <br> | ||
| − | '''Anticooling:''' <br> | + | '''Anticooling (i.e. energy recuperative warming/heating):''' <br> |
To get the energy back that was invested to cool below room temperature and<br> | To get the energy back that was invested to cool below room temperature and<br> | ||
to not freeze clean room air in further up [[assembly levels]] <br> | to not freeze clean room air in further up [[assembly levels]] <br> | ||
the so far assembled parts-fragments need to be warmed up again before proceeding to higher assembly levels that <br> | the so far assembled parts-fragments need to be warmed up again before proceeding to higher assembly levels that <br> | ||
no longer involve (unguided) aligning of atomic bonds. <br> | no longer involve (unguided) aligning of atomic bonds. <br> | ||
| − | Basically one needs to ''' | + | Basically one needs to '''recuperate the cooling energy by heat engine'''. |
Given layer geometry of [[assembly level]] ([[assembly layers]]) as a possible self suggesting geometry <br> | Given layer geometry of [[assembly level]] ([[assembly layers]]) as a possible self suggesting geometry <br> | ||
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== Taking cooling to its limit == | == Taking cooling to its limit == | ||
| − | + | See main page: [[The limits of cooling]] | |
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== Related == | == Related == | ||
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* [[Cooling by heating]] | * [[Cooling by heating]] | ||
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| + | * [[Limits of power density imposed by limits of cooling]] | ||
| + | * [[Power density]] | ||
Latest revision as of 19:32, 15 September 2024
Cooling is both relevant in both
- mundane and important practical systems and
- especially in systems that aim to go to the absolute limits of what is possible
The latter by nature goes in quite speculative territory as
it is not compatible with conservative estimation and exploratory engineering.
The latter relates to a common misconception about the limits of power density:
Taking stated numbers too literally
See page: Limits of power density imposed by limits of cooling
Practical cooling in gem-gum factories
Heat that needs to be removed originates from:
- dissipation from (more or less intentional) snapping instabilities
- more subtle inefficiencies in piezomechanosynthesis
- frictive dissipation – Only partly recuperable by heat engine due to conversion of free energy into bound energy.
- squeeze-out of entropy – heat from moving disorder in positional space to disorder in impulse space (aka heat) (fully recuperable)
Temperatures to cool to:
For reliability of piezomechanosynthesis lower is better.
Below some point there are diminishing returns though.
Optimal might likely be somewhere around liquid nitrogen. Maybe a bit lower.
Room-temperature works bit is a bit too high for good reliability.
Liquid helium temperatures are likely overkill.
Anticooling (i.e. energy recuperative warming/heating):
To get the energy back that was invested to cool below room temperature and
to not freeze clean room air in further up assembly levels
the so far assembled parts-fragments need to be warmed up again before proceeding to higher assembly levels that
no longer involve (unguided) aligning of atomic bonds.
Basically one needs to recuperate the cooling energy by heat engine.
Given layer geometry of assembly level (assembly layers) as a possible self suggesting geometry
cooling and anticooling forms a "cooling sandwich".
From an surface to volume ratio this thin layer sandwich geometry is far from optional.
Maybe hinting on that an other more batch processing
and serializing in-between geometry might be worth considering.
Increasing fast track transport distances increases frictive losses though so its a tradeoff optimization.
Also depending on how efficient piezomechanosynthesis can be made as it likely dominates over frictive losses.
(TODO: Investigate possible assembly level geometries taking this into account too.)
Taking cooling to its limit
See main page: The limits of cooling
Related
- Hyper high throughput microcomponent recomposition
- APM and nuclear technology: Fusion
- Rocket engines and AP technology: Carriage particle accelerators
