Revision as of 15:56, 21 August 2021

In any kind of productive nanosystem that manufactures a prosuct bottom up from the nanoscale to the macroscale, the the producer and the product need to be pushed apart in some ways in order for them to not mutually obstruct them during the manufacturing process.

Which way?

Two modes are thinkable:

• The static non-moving producer pushes out and away the product during its production
• The the producing machinery gets somehow out of the way to make space for the static in place sitting non-transported product.

Producer pushes out the product

• Gemstone metamaterial on chip factories
• On-chip microcomponent recomposers
• Microcomponent maintenance microbots – when used for on chip style production

Producer gets out of the way of the growing product

Main article: Hyper high throughput microcomponent recomposition

• Molecular assemblers – Outdated concept!
• Microcomponent maintenance microbots – when used for volume scaffold assembler style production

Hyper high throughput microcomponent recomposition

To reap the benefits of the scaling law of higher throughput of smaller machinery the pushapart at larger size-scales needs to go way above the scale natural speeds. This means taking turns becomes a no-go. What's needed are straight expulsion channels. Maybe lined with superlubricating stratified shear bearings.

• This may be feasible for microcomponent recomposition due to low energy turnover and high efficiency requiring manageable cooling
• This may not be feasible for piezochemical mechanosynthesis due to high energy turnover and lower efficiency requiring much more cooling

Which way?

Two options:

• The microcomponents are shot out at brutally high speed from the product under assembly through straight channels that may more or less narrow down.
  The fractal growth speedup limit applies. So for a solid nonporous product there will be some slowdown towards the end.
• The product is shot out at brutally high speed from straight channels in a overly thick on-chip microcomponent recomposer. More of a thick a slab than a thin chip.

Related

• Complementary facing similar issues: Producer supply dragin
• Higher throughput of smaller machinery
• Deliberate slowdown at the lowest assembly level
• Level throughput balancing
• Macroscale slowness bottleneck
• Multilayer assembly layers

Transporting products out from some zone with local overproduction
requires speeds exceeding the one that scale natural frequencies would imply.