Repair - Revision history

Apm: /* Related */ added link to Hierarchical intentional breaking interfaces

2026-08-15T16:53:47Z

Related: added link to Hierarchical intentional breaking interfaces

← Older revision		Revision as of 18:53, 15 August 2026
Line 117:		Line 117:
	* [[Redundancy]] … have systems keep running longer before repair (or disposal) is needed		* [[Redundancy]] … have systems keep running longer before repair (or disposal) is needed
	* [[Self repairing system]]		* [[Self repairing system]]
			* '''[[Hierarchical intentional breaking interfaces]]'''
	----		----
	* '''[[The three stabilities]]'''		* '''[[The three stabilities]]'''

Apm: /* Related */ added Self repairing system

2026-08-15T14:50:08Z

Related: added Self repairing system

← Older revision		Revision as of 16:50, 15 August 2026
Line 116:		Line 116:
	* [[Cleavage plane]]		* [[Cleavage plane]]
	* [[Redundancy]] … have systems keep running longer before repair (or disposal) is needed		* [[Redundancy]] … have systems keep running longer before repair (or disposal) is needed
			* [[Self repairing system]]
	----		----
	* '''[[The three stabilities]]'''		* '''[[The three stabilities]]'''

Apm: /* Repair of radiation damage */

2026-08-15T14:49:51Z

Repair of radiation damage

← Older revision		Revision as of 16:49, 15 August 2026
Line 98:		Line 98:
	In always on systems that are not to be taken offline at macroscale <br>		In always on systems that are not to be taken offline at macroscale <br>
	This allows for slow sparse repair systems like '''[[microcomponent maintenance microbot]]s'''. <br>		This allows for slow sparse repair systems like '''[[microcomponent maintenance microbot]]s'''. <br>
	Note and be ~~very~~ aware about that these are a completely different thing than <br>		One for of in situ [[self repairing system]]. <br>

			Note and be aware about that these are a completely different thing than <br>
	[[Molecular assemblers as advanced productive nanosystem (outdated)]] <br>		[[Molecular assemblers as advanced productive nanosystem (outdated)]] <br>
	See: [[Why ultra-compact molecular assemblers are a bad and long outdated idea]] <br>		See: [[Why ultra-compact molecular assemblers are a bad and long outdated idea]] <br>

Apm: /* Repair of radiation damage */

2026-08-15T14:48:46Z

Repair of radiation damage

← Older revision		Revision as of 16:48, 15 August 2026
Line 96:		Line 96:

	For background radiations damage is very slow and continuous. <br>		For background radiations damage is very slow and continuous. <br>
	In always on systems that are not to be taken offline at macroscale		In always on systems that are not to be taken offline at macroscale <br>
	This allows for slow sparse repair systems like '''[[microcomponent maintenance microbot]]s'''. <br>		This allows for slow sparse repair systems like '''[[microcomponent maintenance microbot]]s'''. <br>
	Note and be very aware about that these are a completely different thing than <br>		Note and be very aware about that these are a completely different thing than <br>

Apm: /* Related */

2026-08-15T09:51:50Z

← Older revision		Revision as of 11:51, 15 August 2026
Line 114:		Line 114:
	* [[Cleavage plane]]		* [[Cleavage plane]]
	* [[Redundancy]] … have systems keep running longer before repair (or disposal) is needed		* [[Redundancy]] … have systems keep running longer before repair (or disposal) is needed
	* [[The three stabilities]]
	----		----
			* '''[[The three stabilities]]'''
	* [[Mechanical damage]] (related: [[Mechnical stability]])		* [[Mechanical damage]] (related: [[Mechnical stability]])
	* [[Chemical damage]] (related: [[Chemical stability]])		* [[Chemical damage]] (related: [[Chemical stability]])
	* [[Thermal damage]] (related: [[Thermal stability]])		* [[Thermal damage]] (related: [[Thermal stability]])
	* [[Radiation damage]] (related: [[Radiation stability]])		* [[Radiation damage]] (related: [[Radiation stability]])

Apm: /* Related */

2026-08-15T09:51:31Z

← Older revision		Revision as of 11:51, 15 August 2026
Line 111:		Line 111:

	* [[Microcomponent recomposer (disambiguation)]]		* [[Microcomponent recomposer (disambiguation)]]
	* [[Recycling]], [[Mechanosphere]],		* [[Recycling]], [[Mechanosphere]], [[Gem-gum waste dissolution]], [[Diamondoid waste incineration]]
	* [[Cleavage plane]]		* [[Cleavage plane]]
	* [[Redundancy]] … have systems keep running longer before repair (or disposal) is needed		* [[Redundancy]] … have systems keep running longer before repair (or disposal) is needed

Apm: basic page

2026-08-15T09:50:16Z

basic page

New page

Advanced [[gem-gum-tech]] products will have long run-times without taking much damage. 
Main damage mechanism being:
* [[Mechanical damage]] (related: [[Mechanical stability]])
* [[Chemical damage]] (related: [[Chemical stability]])
* [[Thermal damage]] (related: [[Thermal stability]])
* [[Radiation damage]] (related: [[Radiation stability]])

= Mechanical damage =

This is highly dependent on product/artifact/system//material design. 
Naive simple [[mechanical metamaterial]]s may break in more nasty (harder to repair reuse and more [[spill]]ing) ways. 
Well in some cases of eventually biodegradable structures weakness and breaking by mechaniocal attack may actually be a desired property. 
Thing materials replacing plastics like of drinkingbottles and food packaging and this kind of stuff. 

Nicely designed systems may go for the design approach of '''[[hierarchical intentional breaking interfaces]]'''. 
Which makes [[spill]] by breaking nanoencapsulations via mechanical attack [[FAPP]] impossible. 
Other attacks can still cause spill and more problematic and hard to repair damage. See below. 

== Repair of mechanical damage ==

For well designed systems in most cases an [[on chip microcomponent recomposer]] will do. 
Higher assembly levels may be involved. 
Sometimes thorough cleaning and clean chamber re-assembly by precise alingnment may work. 
Some few interfaces may even actively help in realignment. See page: [[Connection method]] 

= Chemical damage =

* Outer surfaces: hydrogenated diamond is very good for most cases, fluorinated surfaces makes it even more inert
* Internal surfaces: These should usually never be accessible in the first place needing other (mechanical) damage cracking the internals open before

== Repair of chemical damage ==

Changes on outer surface passivation may often be tolerable not even needing repair. 
Deeper reaching damage => same thermochemical treatment as with thermal damage. 

= Thermal damage =

Well designed products/artifacts/systems/metamaterials should have some 
thermal overload protection in-built much like modern electronics do. 
So running with too much power for the amount of available cooling (speed times force product on mechanical side) 
would only be a source of thermal damage for badly designed systems. 

Thermal sources from outside the product/artifact/system/metamaterial 
can't be limited and can't be always assumed to be present. 
If some idiot with destructive tendencies (or some curious scientist 😂) 
is holding a blow torch to the product/artifact/system/metamaterial 
it will in most cases be destroyed where it got too hot. 

That is the case unless it is specifically designed to cope with that sort of attack like 
being built form bigger nanosystem components out of more refcartory materrials like moissanite (silicon carbide) 
with active cooling so far and so long this is possible. 
When connected to a power source for indefinite active cooling 
then some thermal attack deflection metamaterialy may make thermal destruction very hard to nigh impossible. 
Requiring plasma burners that start to blur over into the radiation damage regime. 
These are few very specific intentionally designed [[metamaterial]] systems though. 

One may want to have the outer skin of housing more heat and combustion resistant (not diamond based). 
Especially in areas that are prone to wildfires. 
Unlike wood many if not most [[base materials with high potential]] (prominent exception [[diamond]]) 
do not burn but just melt to slack either as they are already partly or fully oxidic or as they are form nonvolative oxides. 
E.g. all [[titanium nonmetallide]] gems are [[refactory]] and just melt to slack at very high blindingly bright white hot temperatures. 
Wildfires do not get all that hot. Their temperatures are no concern at all for bulk [[moissanite]] or [[titanium nonmetallide]] bricks. 
[[Nonbonded atomically precise nanoscale interfaces at high temperatures]] between these nano-bricka are an interesting question. 
Perhaps nitrogen phosphorus terminated or oxygen sulfur terminated moissanite? Digressing. 

== Repair of thermal damage ==

Limitedly possible. 
Outcomes are likely severely damaged in high quantity and in larger depth. 
Likely best option: Destructive thermochemical dissolution followed by 
either reintroduction into the [[mechanosphere]] or the [[biosphere]] 
See: [[Gem-gum waste dissolution]] 

If the damage is localized macroscale generous excision of the most severely damaged parts 
using the highest levels of [[convergent assembly]] may be an option to maximize on amount for [[microcomponents]] that can still be reused. 
On the wild vision end of the spectrum: [[Gem-gum anemone-arm fairy-hand manipulator]]s somehow helping in performing the "excision operation". 
Don't get carried away with [[bioanalogies]] though. 

= Radiation damage =

Gradual but very slow [[radiation damage]] 
that is kept almost unnoticeable via routing around damage and nanosystem [[redundancy]] 
Not all radiation damage is equal. 
★ Some hits just cause some single bonds here and there very rarely to break. 
– These will often self heal for multiply bonded atoms which are common in and on [[crystolecules]] in [[gem-gum-tech]]s gemstone based nanosystems. 
– These will often be tolerable e.g. on non-interacting structural surfaces. 
★ Some hits are high energy and cause vast cascades of damage affecting a larger volume. 

Harsh radiation environments are problematic for any kind of intricate nanosystems both biological and artificial. 
Particular examples include … 
★ the radiation belts around Jupiter 
★ the interior of nuclear reactors (both in proper operation and in broken melted core state) 
=> options: macroscale shielding ans/or crude radiation hard mesoscale [[crystolecule]] systems

== Repair of radiation damage ==

For background radiations damage is very slow and continuous. 
In always on systems that are not to be taken offline at macroscale
This allows for slow sparse repair systems like '''[[microcomponent maintenance microbot]]s'''. 
Note and be very aware about that these are a completely different thing than 
[[Molecular assemblers as advanced productive nanosystem (outdated)]] 
See: [[Why ultra-compact molecular assemblers are a bad and long outdated idea]] 
Simpler systems can use '''[[on chip microcomponent recomposer]]s'''. 

Since the damage here usually is homogeneously distributed on the nanoscale 
higher levels of [[convergent assembly]] are no help here. 
There may be the rare exception of being hit by a narrow beam of directed radiation. 
This sounds like advanced less or more hard ScFi weaponry context. 

= Related =

* [[Microcomponent recomposer (disambiguation)]]
* [[Recycling]], [[Mechanosphere]],
* [[Cleavage plane]]
* [[Redundancy]] … have systems keep running longer before repair (or disposal) is needed
* [[The three stabilities]]
----
* [[Mechanical damage]] (related: [[Mechnical stability]])
* [[Chemical damage]] (related: [[Chemical stability]])
* [[Thermal damage]] (related: [[Thermal stability]])
* [[Radiation damage]] (related: [[Radiation stability]])