Consistent design for external limiting factors - Revision history

Apm: Category:Far term target

2026-03-29T19:27:44Z

← Older revision		Revision as of 21:27, 29 March 2026
Line 53:		Line 53:

	[[Category:Technology level III]]		[[Category:Technology level III]]
			[[Category:Far term target]]

Apm: /* Related */ added a view relevant links

2024-12-23T18:26:57Z

Related: added a view relevant links

← Older revision		Revision as of 20:26, 23 December 2024
Line 43:		Line 43:
	== Related ==		== Related ==

			* [[Naked core]] ‎– High temperature resilient and high radiation resilient advanced systems will need to strip back all involvement of singly bonded polymers/foldamers.
			* [[Polymer]], ‎[[Chemospring]], [[Entropomechanical conversion]] – Thin single bond polymer chains likely introduce limited heat resistance
			* [[Diamondoid waste incineration]] – Consistent design for full combustibility can be one thing to aim at.
			* [[Gemstone based medical nanobot]] – These will be optimized for biocompatibility rather than high heat (and/or radiation) tolerance. Some may be surface hardened against acid when they are supposed to go into the stomach.
			* See "What links here" in the sidebar.
			----
	Another case for self limiting but here not for performance but for safety:		Another case for self limiting but here not for performance but for safety:
	* [[Self limitation for safety]]		* [[Self limitation for safety]]

	[[Category:Technology level III]]		[[Category:Technology level III]]

Apm: added back-link to Self limitation for safety

2024-12-23T18:11:54Z

added back-link to Self limitation for safety

← Older revision		Revision as of 20:11, 23 December 2024
Line 40:		Line 40:
	* Close proximity of atoms that like to form low-energy highly volatile compounds. Many nitrogen atoms close together e.g. may tend to form N<sub>2</sub> gas on heating. Also water and carbon dioxide may form in very harsh thermal conditions.		* Close proximity of atoms that like to form low-energy highly volatile compounds. Many nitrogen atoms close together e.g. may tend to form N<sub>2</sub> gas on heating. Also water and carbon dioxide may form in very harsh thermal conditions.
	* Diamond is metastable and can turn into graphite at too high temperatures. Other [[refractory materials]] are better suited for high temperature applications.		* Diamond is metastable and can turn into graphite at too high temperatures. Other [[refractory materials]] are better suited for high temperature applications.

			== Related ==

			Another case for self limiting but here not for performance but for safety:
			* [[Self limitation for safety]]

	[[Category:Technology level III]]		[[Category:Technology level III]]

Apm: thrmomechanical => emtropomechanical

2021-06-14T18:32:21Z

thrmomechanical => emtropomechanical

← Older revision		Revision as of 20:32, 14 June 2021
Line 29:		Line 29:
	There are likely several cases where one might want to include temperature sensitive parts and accept the implicated severe cuts in thermal resilience.		There are likely several cases where one might want to include temperature sensitive parts and accept the implicated severe cuts in thermal resilience.
	Some of these could be:		Some of these could be:
	* [[~~Thermomechanical~~ converter\|Entropic batteries]] – They might work better with smaller molecules that are prone to freeze. <br>(In case of an implementation with floppy singly linked chain molecules they likely "feature" high sensitivity to radiation damage beside thermal limits.)		* [[Entropomechanical converter\|Entropic batteries]] – They might work better with smaller molecules that are prone to freeze. <br>(In case of an implementation with floppy singly linked chain molecules they likely "feature" high sensitivity to radiation damage beside thermal limits.)
	* A situation where thermal capacity bog-down due to integration of thermally sensitive parts does not matter at all are advanced [[medical nanodevices]] since those are embedded in a highly temperature sensitive environment anyway.		* A situation where thermal capacity bog-down due to integration of thermally sensitive parts does not matter at all are advanced [[medical nanodevices]] since those are embedded in a highly temperature sensitive environment anyway.
	* ...		* ...

Apm: /* Absolute maximum/minimum Temperature */ added missing "to"

2019-10-11T12:50:25Z

Absolute maximum/minimum Temperature: added missing "to"

← Older revision		Revision as of 14:50, 11 October 2019
Line 27:		Line 27:
	The same happens when one would start using technology of the (with gem-gum technology unrelated) [[brownian technology path]].		The same happens when one would start using technology of the (with gem-gum technology unrelated) [[brownian technology path]].

	There are likely several cases where one might want include temperature sensitive parts and accept the implicated severe cuts in thermal resilience.		There are likely several cases where one might want to include temperature sensitive parts and accept the implicated severe cuts in thermal resilience.
	Some of these could be:		Some of these could be:
	* [[Thermomechanical converter\|Entropic batteries]] – They might work better with smaller molecules that are prone to freeze. <br>(In case of an implementation with floppy singly linked chain molecules they likely "feature" high sensitivity to radiation damage beside thermal limits.)		* [[Thermomechanical converter\|Entropic batteries]] – They might work better with smaller molecules that are prone to freeze. <br>(In case of an implementation with floppy singly linked chain molecules they likely "feature" high sensitivity to radiation damage beside thermal limits.)

Apm: removed renegade "of"

2019-10-11T12:46:24Z

removed renegade "of"

← Older revision		Revision as of 14:46, 11 October 2019
Line 2:		Line 2:
	When designing a product one usually wishes that it poses some resilience to environmental influences.		When designing a product one usually wishes that it poses some resilience to environmental influences.
	A few critical delicate components in a mainly robust system can bog down the whole system.		A few critical delicate components in a mainly robust system can bog down the whole system.
	Those components are the weakest links and constitute a of bottleneck.		Those components are the weakest links and constitute a bottleneck.

	To be able to avoid including components that disproportionately bog-down the whole system one should pair components with their resilience ranges.		To be able to avoid including components that disproportionately bog-down the whole system one should pair components with their resilience ranges.

Apm: /* Absolute maximum/minimum Temperature */ corrected link from Chemomechancial converter to Thermomechanical converter and added note on radiation sensitivity

2017-09-09T10:39:49Z

Absolute maximum/minimum Temperature: corrected link from Chemomechancial converter to Thermomechanical converter and added note on radiation sensitivity

← Older revision		Revision as of 12:39, 9 September 2017
Line 29:		Line 29:
	There are likely several cases where one might want include temperature sensitive parts and accept the implicated severe cuts in thermal resilience.		There are likely several cases where one might want include temperature sensitive parts and accept the implicated severe cuts in thermal resilience.
	Some of these could be:		Some of these could be:
	* [[~~chemomechanical converters~~\|Entropic batteries]] – They might work better with smaller molecules that are prone to freeze.		* [[Thermomechanical converter\|Entropic batteries]] – They might work better with smaller molecules that are prone to freeze. <br>(In case of an implementation with floppy singly linked chain molecules they likely "feature" high sensitivity to radiation damage beside thermal limits.)
	* A situation where thermal capacity bog-down due to integration of thermally sensitive parts does not matter at all are advanced [[medical nanodevices]] since those are embedded in a highly temperature sensitive environment anyway.		* A situation where thermal capacity bog-down due to integration of thermally sensitive parts does not matter at all are advanced [[medical nanodevices]] since those are embedded in a highly temperature sensitive environment anyway.
	* ...		* ...

	The different technology path branches (micro chamber managed [[brownian technology path]] vs late stages of [[incremental ~~technology~~ path]]) have vastly different allowed temperature ranges. It is probably advisable to keep track off all the allowed temperature ranges for system components and keep the technology path branches as separate as possible.		The different technology path branches (micro chamber managed [[brownian technology path]] vs late stages of [[incremental path]]) have vastly different allowed temperature ranges. It is probably advisable to keep track off all the allowed temperature ranges for system components and keep the technology path branches as separate as possible.

	Potentially thermally weak structures to look out for could be:		Potentially thermally weak structures to look out for could be:

Apm: /* Absolute maximum/minimum Temperature */ removed lone forgotten ")"

2017-09-09T10:29:52Z

Absolute maximum/minimum Temperature: removed lone forgotten ")"

← Older revision		Revision as of 12:29, 9 September 2017
Line 25:		Line 25:
	When one would keep using technology of early steps of the [[incremental path]] to advanced gem-gum technology (that is when one would keep in remnants of the [[bootstrapping]] process) in [[technology level III\|advanced gem-gum technology]] then this new technology will be bogged-down to an accordingly restricted allowed range of operation temperature.		When one would keep using technology of early steps of the [[incremental path]] to advanced gem-gum technology (that is when one would keep in remnants of the [[bootstrapping]] process) in [[technology level III\|advanced gem-gum technology]] then this new technology will be bogged-down to an accordingly restricted allowed range of operation temperature.
	Especially much of the otherwise completely allowed low temperature regime all the way down to zero kelvin will be cut off.		Especially much of the otherwise completely allowed low temperature regime all the way down to zero kelvin will be cut off.
	The same happens when one would start using technology of the (with gem-gum technology unrelated) [[brownian technology path]]).		The same happens when one would start using technology of the (with gem-gum technology unrelated) [[brownian technology path]].

	There are likely several cases where one might want include temperature sensitive parts and accept the implicated severe cuts in thermal resilience.		There are likely several cases where one might want include temperature sensitive parts and accept the implicated severe cuts in thermal resilience.

Apm: /* Absolute maximum/minimum Temperature */ further split-up for better comprehensibility

2017-09-09T10:28:12Z

Absolute maximum/minimum Temperature: further split-up for better comprehensibility

← Older revision		Revision as of 12:28, 9 September 2017
Line 23:		Line 23:
	At and below the microscale thermal equilibrium is almost always present (more or less) due very low levels of thermal isolation which are caused by the [[scaling law]] that surface area per enclosed volume rises with shrinking size.		At and below the microscale thermal equilibrium is almost always present (more or less) due very low levels of thermal isolation which are caused by the [[scaling law]] that surface area per enclosed volume rises with shrinking size.

	When one would keep using technology of early steps of the [[incremental path]] (that is remnants of the ~~bootstrapping process) or one starts using technology of the APM unrelated~~ [[~~brownian technology path~~]]) in [[technology level III\|advanced gem-gum technology]] then ~~the~~ new technology will be bogged-down to an accordingly restricted allowed range of operation temperature.		When one would keep using technology of early steps of the [[incremental path]] to advanced gem-gum technology (that is when one would keep in remnants of the [[bootstrapping]] process) in [[technology level III\|advanced gem-gum technology]] then this new technology will be bogged-down to an accordingly restricted allowed range of operation temperature.
	Especially much of the otherwise completely allowed low temperature regime all the way down to zero kelvin will be cut off.		Especially much of the otherwise completely allowed low temperature regime all the way down to zero kelvin will be cut off.
			The same happens when one would start using technology of the (with gem-gum technology unrelated) [[brownian technology path]]).

	There are likely several cases where one might want include temperature sensitive parts and accept the implicated severe cuts in thermal resilience.		There are likely several cases where one might want include temperature sensitive parts and accept the implicated severe cuts in thermal resilience.

Apm: /* Absolute maximum/minimum Temperature */ added link to page: scaling law

2017-09-09T10:23:09Z

Absolute maximum/minimum Temperature: added link to page: scaling law

← Older revision		Revision as of 12:23, 9 September 2017
Line 21:		Line 21:
	This is of course only true when one assumes thermally equilibrium at the size scale of the whole system. Otherwise one could just protect the sensitive parts by thermally isolating them.		This is of course only true when one assumes thermally equilibrium at the size scale of the whole system. Otherwise one could just protect the sensitive parts by thermally isolating them.

	At and below the microscale thermal equilibrium is almost always present (more or less) due very low levels of thermal isolation which are caused by the scaling law that surface area per enclosed volume rises with shrinking size.		At and below the microscale thermal equilibrium is almost always present (more or less) due very low levels of thermal isolation which are caused by the [[scaling law]] that surface area per enclosed volume rises with shrinking size.

	When one would keep using technology of early steps of the [[incremental path]] (that is remnants of the bootstrapping process) or one starts using technology of the APM unrelated [[brownian technology path]]) in [[technology level III\|advanced gem-gum technology]] then the new technology will be bogged-down to an accordingly restricted allowed range of operation temperature.		When one would keep using technology of early steps of the [[incremental path]] (that is remnants of the bootstrapping process) or one starts using technology of the APM unrelated [[brownian technology path]]) in [[technology level III\|advanced gem-gum technology]] then the new technology will be bogged-down to an accordingly restricted allowed range of operation temperature.