Apm: Category:Far term target

2026-03-29T18:31:07Z

← Older revision		Revision as of 20:31, 29 March 2026
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	* [[Productive Nanosystems From molecules to superproducts]]		* [[Productive Nanosystems From molecules to superproducts]]
	* [[Gemstone metamaterial on chip factory]]		* [[Gemstone metamaterial on chip factory]]

			[[Category:Far term target]]

Apm: /* Microcomponent maintainance microbot */

2025-08-21T12:17:58Z

Microcomponent maintainance microbot

← Older revision		Revision as of 14:17, 21 August 2025
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	These are a fully optional addition to		These are a fully optional addition to
	* [[gemstone metamaterial on-chip factories]] or		* [[gemstone metamaterial on-chip factories]] or
	* final [[~~gemstome~~ metamaterial]] products.		* final [[gemstone metamaterial]] products.

	They could be used for		They could be used for
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	* repair/replace/remove [[microcomponents]] based on the results of some tests they perform on them.		* repair/replace/remove [[microcomponents]] based on the results of some tests they perform on them.
	* operate with assembly capabilities on the fourth assembly level (manipulatiing their own size) the third and perhaps even second assembly level.		* operate with assembly capabilities on the fourth assembly level (manipulatiing their own size) the third and perhaps even second assembly level.


	= Related =		= Related =

Apm: Created page with "'''sinterface welding & assembly to crystolecular units''' * '''Previous processing step:''' Assembly level 2 (gem-gum factory) * '''Next processing step:''' Assembly l..."

2022-05-21T08:47:07Z

Created page with "'''sinterface welding & assembly to crystolecular units''' * '''Previous processing step:''' Assembly level 2 (gem-gum factory) * '''Next processing step:''' Assembly l..."

New page

'''sinterface welding & assembly to crystolecular units'''

* '''Previous processing step:''' [[Assembly level 2 (gem-gum factory)]]
* '''Next processing step:''' [[Assembly level 4 (gem-gum factory)]]
* Up: [[Assembly levels]]

= Overview =

* '''In go:''' fully assembled [[crystolecular units]]s
* '''Out go:''' assembled [[microcomponent]]s
* '''Where processing is done:''' [[crystoleculecular unit to microcomponent assembly chamber]]s.
* '''What processing is done:''' Pick and place assembly with various adapters for basic end effectors (preferably parallel robotics for stiffness)

Assembly is done similarly to [[assembly level 2]] pick&place but typically with
* even more reversible form closure and
* even less [[seamless covalent welding]] of [[surface interfaces]].

Since at this assembly level some exposed open bonds of [[surface interfaces]] can still be present 
this assembly-step still needs to take place in [[practically perfect vacuum]] in small gas-tightly enclosed build-chambers. 
Thus it would be problematic for this assembly level to be the last one of the stack since the last one 
needs to open to a large macroscopic product sized open space where trace gas pollutions are much more difficult to control and prevent.

Finished ''[[microcomponents]]'' ready for the next (the third) assembly level are complex or simple conglomerates of [[crystolecular unit]]s (and many small [[crystolecule]]s). 

== Products microcomponents can easily be surface-nonreactive, sealed, and ready for final expulsion in next assembly level ==

Open [[surface interfaces]] for [[covalent welding]] with open bonds are no longer desired. 

At this (the third) assembly level the products (microcomponents) can be easily designed such that they "are sealed".
That is designed such that they no longer have any on the outside exposed
[[open bonds]] (including e.g. [[surface interfaces]] for [[seamless covalent welding]]).
Thus the next (the fourth) assembly level (where microcomponents are the input) can potentially expulse its products to an environment containing reactive gasses (like clean air) and consequently it can be the last assembly level in the stack. This is totally optional though.

Only if the next assembly level in in air then the
finished ''[[microcomponents]]'' absolutely must not use open [[covalent welding]] interfaces.

Open bonds in the final assembled microcomponent are still ok if they are fully sealed. 
Such [[enclosed radicals|enclosed radicals]] may be used for [[locking mechanisms]], springs, energy- and data-storage.

== Recycling ==

While [[crystolecular unit]]s have less [[surface interfaces]] than smaller [[crystolecules]]
they still may have some of them.

This (the third) assembly level is the last one where some [[surface interfaces]] of 
[[crystolecular unit]]s are [[seamless covalent welding|welded]] together. 
[[Seamless covalent welding]] in many cases is an irreversible assembly operation.

For recycling of the whole finished ''[[microcomponents]]'' it is highly advisable to
* keep all the outer interlocking mechanisms reversible and to
* physically tag all ''[[microcomponents]]'' so that they remain recomposable later-on even after they where shuffled.
* Open documentation will also improve chances for reuse and thereby help to minimize biosphere pollution. See: [[Gemstone waste problem]].

Since at this assembly level mostly whole big [[crystolecular unit]]s are handled 
most [[structural overhangs]] (e.g. around voids) should be assemblable with only three degrees of freedom (like in an 3D printer).

High programmability is desired. 
Perhaps even more so than in the next assembly step where a lot of in place production can occur.

== Reversibility of the products of the third assembly level – (''crystolecule component tweaking'') ==

Finished ''[[microcomponents]]'' might be designed such that they provide:
* some post-assembly-adjustability on the smaller [[crystolecular unit]] and [[crystolecule]] size levels
* some means for mechanical testing of nominal function of their innards without disassembly via [[mechanical IO ports]]

=== Microcomponent maintainance microbot ===

These are a fully optional addition to
* [[gemstone metamaterial on-chip factories]] or
* final [[gemstome metamaterial]] products.

They could be used for
* testing of microcomponents without disasembly
* some reassemblies/recompositions/reconstructtions/reconfigurations of reversible assembled [[crystolecule units]] or even smaller [[crystolecules]]

For more details see main page: [[Microcomponent maintainance microbot]]

{{wikitodo|move the below out to the main page linked above and integrate it there}}

For operating such adjustment and testing options 
general purpose ''[[Microcomponent maintenance microbot|maintainance microbots]]'' with 
a similar size to microcomponents and some mobility (possibly [[legged mobility]] or something else) 
Could remain permanently stationed within the final product.

Such [[Microcomponent maintenance microbot]]s should be able able to
* operate sub-functionalities (like functional testing) of microcomponents on the smaller [[crystolecular unit]] and crystolecule size scale (3rd and 2nd assembly level actions). 
* disconnect and pull out as-broken-detected microcomponents and push in and connect new replacement microcomponents
* eventually do some repair of microcomponents without replacing them as a whole (difficult 2nd assembly level actions).
In other words [[Microcomponent maintenance microbot]]s could:
* repair/replace/remove [[microcomponents]] based on the results of some tests they perform on them.
* operate with assembly capabilities on the fourth assembly level (manipulatiing their own size) the third and perhaps even second assembly level.

= Related =

* [[Productive Nanosystems From molecules to superproducts]]
* [[Gemstone metamaterial on chip factory]]

Assembly level 3 (gem-gum factory) - Revision history

Apm: Category:Far term target

Apm: /* Microcomponent maintainance microbot */

Apm: Created page with "'''sinterface welding & assembly to crystolecular units''' * '''Previous processing step:''' Assembly level 2 (gem-gum factory) * '''Next processing step:''' Assembly l..."